H05K 7/20854
Heat transfer by conduction from internal heat source to heat radiating structure
Official title: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)}
H05K7/20854 (Heat transfer by conduction from internal heat source to heat radiating structure) appears on 468 US grants and 551 published applications in this corpus.
Search patents in H05K- Granted patents
- 468
- Published applications
- 551
- Assignees
- 231
- Inventors
- 1,122
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 9 | 3 |
| 2002 | 6 | 2 |
| 2003 | 5 | 8 |
| 2004 | 4 | 11 |
| 2005 | 4 | 8 |
| 2006 | 9 | 10 |
| 2007 | 4 | 7 |
| 2008 | 6 | 13 |
| 2009 | 5 | 8 |
| 2010 | 7 | 3 |
| 2011 | 7 | 16 |
| 2012 | 4 | 6 |
| 2013 | 11 | 12 |
| 2014 | 6 | 16 |
| 2015 | 10 | 25 |
| 2016 | 23 | 18 |
| 2017 | 15 | 21 |
| 2018 | 24 | 27 |
| 2019 | 31 | 50 |
| 2020 | 37 | 39 |
| 2021 | 34 | 31 |
| 2022 | 28 | 43 |
| 2023 | 29 | 32 |
| 2024 | 28 | 76 |
| 2025 | 50 | 45 |
| 2026 | 32 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Server rack for electronic components29 Sep 2026US 12,750,984 B2Aptiv Technologies AG
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Apparatus for providing an electronic unit with clips for attachment to a panel18 Aug 2026US 12,713,569 B2Harman International Industries, Incorporated
- Device and method for dissipating heat from an electronic component of a motor vehicle8 Oct 2026US 2026/0313855 A1
- Control apparatus for vehicle1 Oct 2026US 2026/0304712 A1Hyundai Mobis Co., Ltd.
- Electrical component and steering device using the electrical component24 Sep 2026US 2026/0293055 A1Toyoda Gosei Co., Ltd.
- Harness heat dissipation structure24 Sep 2026US 2026/0293066 A1Yazaki Corporation
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
Most cited
By later US patents
- Overmolded electronic module with underfilled surface-mount components204US 6,307,749 B1Delphi Technologies, Inc. · 2001
- Power module153US 4,899,256 AChrysler Motors Corporation · 1990
- Assembly for circuit modules122US 4,811,165 AMotorola, Inc. · 1989
- Arrangement for electronic circuit module114US 5,101,322 AMotorola, Inc. · 1992
- Housing for installation in motor vehicles80US 5,075,822 ATelefunken electronic GmbH · 1991