H05K 7/20563
Within sub-racks for removing heat from electronic boards
Official title: {within sub-racks for removing heat from electronic boards}
H05K7/20563 (Within sub-racks for removing heat from electronic boards) appears on 277 US grants and 255 published applications in this corpus.
Search patents in H05K- Granted patents
- 277
- Published applications
- 255
- Assignees
- 178
- Inventors
- 621
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 1 |
| 2002 | 7 | 6 |
| 2003 | 10 | 3 |
| 2004 | 9 | 6 |
| 2005 | 9 | 12 |
| 2006 | 6 | 12 |
| 2007 | 11 | 8 |
| 2008 | 4 | 17 |
| 2009 | 5 | 9 |
| 2010 | 12 | 10 |
| 2011 | 12 | 9 |
| 2012 | 9 | 7 |
| 2013 | 3 | 13 |
| 2014 | 11 | 18 |
| 2015 | 13 | 11 |
| 2016 | 20 | 11 |
| 2017 | 12 | 14 |
| 2018 | 10 | 10 |
| 2019 | 14 | 8 |
| 2020 | 10 | 8 |
| 2021 | 7 | 7 |
| 2022 | 6 | 10 |
| 2023 | 8 | 18 |
| 2024 | 15 | 10 |
| 2025 | 9 | 9 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low profile attachment method for pluggable optical modules16 Jun 2026US 12,656,560 B2Ciena Corporation
- Compact modular hybrid heat exchanger (CMH2X)14 Apr 2026US 12,604,437 B2Rockwell Collins, Inc.
- Corrosion preventive heatsink for network device3 Feb 2026US 12,543,291 B2Cisco Technology, Inc.
- Hybrid air/liquid-cooled network element, coolant distribution manifold box for use in a hybrid air/liquid-cooled network element, and method for converting an air-cooled network element to a hybrid air/liquid-cooled network element3 Feb 2026US 12,543,295 B2Ciena Corporation
- Dual-mode datacenter cooling system with cooling loops and heat exchangers18 Nov 2025US 12,477,699 B2NVIDIA Corporation
- Glow pit device with electronic heating assembly and related methods13 Aug 2026US 2026/0239574 A1Atleisure LLC
- Heat sink module and network switch23 Jul 2026US 2026/0214858 A1Accton Technology Corporation
- Switch Having Vertically Oriented Host and Mezzanine Cards28 May 2026US 2026/0150215 A1Eridu AI Corporation
- Cooling system7 May 2026US 2026/0129805 A1Tusas- Turk Havacilik Ve Uzay Sanayii Anonim Sirketi
- Bracket apparatus for ambient temperature regulation of network interface cards5 Feb 2026US 2026/0040497 A1Dell Products L. P.
Most cited
By later US patents
- Directed air management system for cooling multiple heat sinks150US 4,851,965 AUnisys Corporation · 1989
- Cooling apparatus of electronic equipment116US 5,361,188 AHitachi, Ltd. · 1994
- Communication equipment cabinet cooling arrangement96US 4,860,163 AAmerican Telephone and Telegraph Company · 1989
- Airflow system93US 6,594,148 B1Cisco Technology, Inc. · 2003
- Reconfigurable airflow director for modular blade chassis84US 7,259,961 B2Intel Corporation · 2007