Cooling apparatus of electronic equipment

In combination, an electronic equipment and a jet stream cooling apparatus for the electronic equipment, said electronic equipment including a plurality of substrates, each of the substrates having a plurality of IC chips and LSI packages with cooling fins mounted thereto;

• said cooling apparatus including first fan means provided at one end of said substrates for supplying a fresh cooling fluid to said IC chips and LSI packages;
• a duct provided between said first fan means and said IC chips and LSI packages, said duct having comb-tooth shaped projections, said projections forming flow paths along the substrates and having a plurality of small holes for guiding said cooling fluid to said IC chips and to said LSI packages;
• and one or more second fan means disposed on said LSI packages adjacent said fins and having high heating value, a rotational speed of said second fan means being controlled depending on a temperature of said packages having high heat value, said first and said second fan means cooperating to impinge said fresh cooling fluid as a jet stream on said LSI packages having high heating values.

In combination, an electronic equipment and a jet stream cooling apparatus for the electronic equipment, said electronic equipment comprising a plurality of substrates having a plurality of IC chips and LSI packages arranged thereon, and said cooling apparatus including first fan means provided at one end side of said substrates for supplying a fresh cooling fluid to said IC chips and LSI packages, and a duct provided between said first fan means and said IC chips and LSI packages,

• said duct having comb-tooth shaped projections, the comb-tooth shaped projections forming flow paths along the substrates, said projections having a plurality of small holes supplying the cooling fluid supplied by said first fan means to said IC chips and LSI packages, respectively, another duct forming flow paths continuously adjacent to said duct, said another duct being provided on another end side of said substrates, second fan means being provided on an exit portion of said another duct and, said second fan means effectively discharging the cooling fluid supplied by said first fan means for cooling said IC chips and LSI packages.