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US 12,477,699 B2Granted
Dual-mode datacenter cooling system with cooling loops and heat exchangers
AssigneeNVIDIA Corporation
InventorsPardeep Shahi, Ali Heydari
Life of this patent
Estimating the term…
Abstract
A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.
Claims17
A system comprising:
- one or more first cooling loops comprising multiple first flow paths extending through multiple servers of multiple datacenter racks to cool one or more first components within the multiple servers having a first power density and one or more second cooling loops comprising multiple second flow paths extending through the multiple servers of the multiple datacenter racks to cool one or more second components within the multiple servers having a second power density, wherein a first cooling loop of the one or more first cooling loops flows first coolant into a server of the multiple servers in a first direction at a first side wall of the server at a first horizontal plane and out of the server in the first direction at a second side wall of the server opposite the first side wall at the first horizontal plane, and wherein a second cooling loop of the one or more second cooling loops flows second coolant into the server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the server in the first direction at the second side wall at the second horizontal plane, wherein the one or more first components are cooled by one or more associated cold plates of the one or more first cooling loops, wherein the first power density is greater than the second power density, and wherein the one or more cold plates are arranged in series.
A server comprising:
- one or more first components having a first power density that are cooled by one or more first cooling loops comprising multiple first flow paths extending through the server and multiple other servers of multiple datacenter racks and one or more second components having a second power density that are cooled by one or more second cooling loops comprising multiple second flow paths extending through the server and the multiple other servers of the multiple datacenter racks, wherein a first cooling loop of the one or more first cooling loops flows first coolant into the server in a first direction at a first side wall of the server at a first horizontal plane and out of the server in the first direction at a second side wall of the server opposite the first side wall at the first horizontal plane, and wherein a second cooling loop of the one or more second cooling loops flows second coolant into the server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the server in the first direction at the second side wall at the second horizontal plane, wherein the one or more first cooling loops comprises one or more cold plates associated with the one or more first components to receive the first coolant, wherein the first power density is greater than the second power density, and wherein the one or more cold plates are arranged in series.
A method comprising:
- cooling, via one or more first cooling loops comprising multiple first flow paths extending through multiple servers of multiple datacenter racks, one or more first components within the multiple servers having a first power density and cooling, via one or more second cooling loops comprising multiple second flow paths extending through the multiple servers of the multiple datacenter racks, one or more second components within the multiple servers having a second power density, wherein a first cooling loop of the one or more first cooling loops flows first coolant into a server of the multiple servers in a first direction at a first side wall of the server at a first horizontal plane and out of the server in the first direction at a second side wall of the server opposite the first side wall at the first horizontal plane, and wherein a second cooling loop of the one or more second cooling loops flows second coolant into the server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the server in the first direction at the second side wall at the second horizontal plane, wherein the one or more first components are cooled by one or more associated cold plates of the one or more first cooling loops, wherein the first power density is greater than the second power density, and wherein the one or more cold plates are arranged in series.
Dependencies are inferred from the claim text.