H05K 7/20154
Heat dissipaters coupled to components
Official title: {Heat dissipaters coupled to components}
H05K7/20154 (Heat dissipaters coupled to components) appears on 1,060 US grants and 1,350 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,060
- Published applications
- 1,350
- Assignees
- 550
- Inventors
- 2,862
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 0 |
| 2002 | 7 | 11 |
| 2003 | 9 | 7 |
| 2004 | 8 | 8 |
| 2005 | 10 | 9 |
| 2006 | 5 | 14 |
| 2007 | 13 | 12 |
| 2008 | 6 | 18 |
| 2009 | 9 | 16 |
| 2010 | 13 | 15 |
| 2011 | 9 | 19 |
| 2012 | 13 | 30 |
| 2013 | 12 | 32 |
| 2014 | 15 | 36 |
| 2015 | 32 | 41 |
| 2016 | 35 | 44 |
| 2017 | 37 | 51 |
| 2018 | 61 | 74 |
| 2019 | 82 | 87 |
| 2020 | 98 | 104 |
| 2021 | 78 | 95 |
| 2022 | 75 | 90 |
| 2023 | 79 | 142 |
| 2024 | 101 | 175 |
| 2025 | 142 | 128 |
| 2026 | 65 | 92 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrical connector having contact elements with superelastic properties29 Sep 2026US 12,749,836 B2Amphenol Corporation
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Multi slot add-in card with first and second cooling air movers and extended heat sink fins29 Sep 2026US 12,750,963 B2Intel Corporation
- Dual mode cooling system for use with in-wall video-codec and other electronic circuits22 Sep 2026US 12,745,364 B2Crestron Electronics, Inc.
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Projector8 Oct 2026US 2026/0310056 A1Seiko Epson Corporation
- Heat sink structure and methods thereof8 Oct 2026US 2026/0313844 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Cooling of electronic components in electronics servers1 Oct 2026US 2026/0304688 A1AMD Design, LLC
- Apparatus, systems, and methods of use for an outdoor mounted temperature regulating enclosure1 Oct 2026US 2026/0304691 A1Iceotope Group Limited
- Cooling system24 Sep 2026US 2026/0293062 A1Mitsubishi Heavy Industries, Ltd.
Most cited
By later US patents
- Directed air management system for cooling multiple heat sinks150US 4,851,965 AUnisys Corporation · 1989
- Heat exchanger for an electronic display137US 8,654,302 B2Manufacturing Resources International, Inc. · 2014
- Electronic device cooling system having guides for guiding a flow of the air evenly132US 6,222,729 B1NEC Corporation · 2001
- Constricted convection cooling system for an electronic display132US 8,854,595 B2Manufacturing Resources International, Inc. · 2014
- Heat sink for electronic devices129US 4,513,812 APapst-Motoren GmbH & Co. KG · 1985