H05K 7/1404
By edge clamping
Official title: {by edge clamping, e.g. wedges}
H05K7/1404 (By edge clamping) appears on 264 US grants and 162 published applications in this corpus.
Search patents in H05K- Granted patents
- 264
- Published applications
- 162
- Assignees
- 185
- Inventors
- 521
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 7 | 0 |
| 1989 | 9 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 10 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 9 | 0 |
| 2000 | 2 | 0 |
| 2001 | 9 | 0 |
| 2002 | 3 | 1 |
| 2003 | 3 | 6 |
| 2004 | 3 | 7 |
| 2005 | 2 | 3 |
| 2006 | 7 | 6 |
| 2007 | 6 | 9 |
| 2008 | 11 | 9 |
| 2009 | 5 | 2 |
| 2010 | 3 | 6 |
| 2011 | 3 | 12 |
| 2012 | 7 | 8 |
| 2013 | 8 | 5 |
| 2014 | 7 | 10 |
| 2015 | 5 | 3 |
| 2016 | 8 | 9 |
| 2017 | 12 | 8 |
| 2018 | 8 | 9 |
| 2019 | 9 | 5 |
| 2020 | 2 | 5 |
| 2021 | 8 | 9 |
| 2022 | 9 | 2 |
| 2023 | 8 | 10 |
| 2024 | 8 | 4 |
| 2025 | 3 | 9 |
| 2026 | 8 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Repeatedly, quickly and removably connectable retaining mechanism8 Sep 2026US 12,733,120 B2Fositek Corporation
- Positioner and server14 Jul 2026US 12,684,728 B2Fulian Precision Electronics (Tianjin) Co., LTD.
- Wedge based circuit board retainer with dual end drivescrew21 Apr 2026US 12,610,490 B2Wavetherm Corporation
- Compact modular hybrid heat exchanger (CMH2X)14 Apr 2026US 12,604,437 B2Rockwell Collins, Inc.
- Staged high-density backplane for electronic modules3 Mar 2026US 12,568,597 B2Western Digital Technologies, Inc.
- Server10 Sep 2026US 2026/0271209 A1Fulian Percision Electronics (Tianjin) Co., LTD.
- Dovetail Rail Chassis for Printed Circuit Boards13 Aug 2026US 2026/0239553 A1National Instruments Corporation
- Adjustable substrate retainer18 Jun 2026US 2026/0173291 A1Murata Manufacturing Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Retainer for electronic modules29 Jan 2026US 2026/0032841 A1Schroff GmbH
Most cited
By later US patents
- Cooling system for electronic modules199US 5,057,968 ALockheed Corporation · 1991
- Printed circuit board installation and retaining apparatus77US 4,914,552 ARexnord Holdings Inc. · 1990
- Composite heat sink/support structure66US 5,949,650 AHughes Electronics Corporation · 1999
- Thermal conductance retainer for electronic printed circuit boards and the like64US 4,751,963 AHughes Aircraft Company · 1988
- Electronic conduction cooling clamp63US 4,298,904 AThe Boeing Company · 1981