Cooling system for electronic modules
AssigneeLockheed Corporation
InventorRobert A. Morrison
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AssigneeLockheed Corporation
InventorRobert A. Morrison
Estimating the term…
The invention is a cooling system for electronic circuit modules such as a printed circuit boards. In detail the invention comprises a housing assembly having first and second opposed plates. The opposed plates include a plurality of spaced guide rails thereon. A plurality of electronic modules each having a metallic frame, are slidably mounted in the opposed guide rails and detachably clampable thereto. A cooling system is included, which comprises: each of the guide rails having internal cooling passages, preferably in a serpentine pattern, with the cooling passages extending from the first and second ends of the rails; and each of the opposed plates having a coolant inlet passage and a coolant outlet passage coupling each end in parallel. A coolant flow control system is provided which insures that phase change cooling is accomplished within the serpentine shaped guide rails.
A modular electronic system comprising:
Dependencies are inferred from the claim text.