US 12,568,597 B2 · Staged high-density backplane for electronic modules

Abstract

An electronics backplane assembly includes respective first and second floating backplane connector assemblies each having a backplane connector coupled to a corresponding backplane plate movably coupled with a chassis wall, and a pair of stepped stoppers coupled to the chassis wall and positioned on each side of each backplane plate. Each stepped stopper pair includes a step at a different distance from the chassis wall and positioned to provide a reactive force to the corresponding backplane plate for incrementally engaging respective backplane connectors of an electronics module with a corresponding floating backplane connector. Each floating backplane connector assembly may include a pair of guide stoppers having a stopper structure at respective positions, coupled to the chassis wall and protruding through holes in each backplane plate, where each backplane plate is positioned for connector engagement between the step structure of each stepped stopper and the stopper structure of each guide stopper.

Claims20

Dependent claims

A backplane assembly comprising:

a first floating backplane connector assembly comprising:
a first floating backplane connector,
a first backplane plate, with which the first floating backplane connector is coupled, movably coupled with a chassis wall, and
a pair of first stepped stoppers coupled to the chassis wall and positioned on each lateral side of the first backplane plate, each first stepped stopper comprising a first step structure at a particular first distance from the chassis wall and dividing each first stepped stopper into engaging and fully-mated portions;
and
a second floating backplane connector assembly comprising:
a second floating backplane connector,
a second backplane plate, with which the second floating backplane connector is coupled, movably coupled with the chassis wall, and
a pair of second stepped stoppers coupled to the chassis wall and positioned on each lateral side of the second backplane plate, each second stepped stopper comprising a second step structure at a particular second distance from the chassis wall and dividing each second stepped stopper into engaging and fully-mated portions;
wherein the first distance of each first step structure is different from the second distance of each second step structure.

7 more elements

A method for incrementally interconnecting an electronics module with a backplane, the method comprising:

inserting, into a chassis of a backplane assembly, an electronics module comprising a first backplane electrical connector and a second backplane electrical connector, including first engaging the first backplane electrical connector with a corresponding first floating backplane connector assembly of the backplane assembly;
and
continuing inserting the electronics module further into the chassis, including subsequently engaging the second backplane electrical connector with a corresponding second floating backplane connector assembly of the backplane assembly.

Dependencies are inferred from the claim text.

Staged high-density backplane for electronic modules

Life of this patent

Staged high-density backplane for electronic modules

Life of this patent

Abstract

Claims20