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US 2026/0239553 A1Published application
Dovetail Rail Chassis for Printed Circuit Boards
AssigneeNational Instruments Corporation
InventorsChristopher White, Jacob Stephen Friedrich
Life of this patent
Estimating the term…
Abstract
An electronics chassis includes an enclosure configured to house a printed circuit board (PCB). The enclosure includes one or more dovetail rails that are configured to affix one or more heat spreaders to the enclosure at a customizable position while the one or more heat spreaders are in thermal contact with the PCB.
Claims20
A chassis, comprising:
- an enclosure configured to house a printed circuit board (PCB) while arranged along a first plane, wherein the enclosure comprises one or more dovetail rails arranged along a first direction that is parallel to the first plane;
- wherein the one or more dovetail rails are configured to affix one or more heat spreaders to the enclosure at a customizable position along the first direction while the one or more heat spreaders are in thermal contact with the PCB.
A chassis, comprising:
- an enclosure configured to house a printed circuit board (PCB) while arranged along a first plane, wherein the enclosure comprises one or more dovetail rails arranged along a first direction that is parallel to the first plane;
- wherein the one or more dovetail rails are configured to affix one or both of an electrical contact and an electromagnetic shields to the enclosure at a customizable position along the first direction while the electrical contact and/or the electromagnetic shields are in contact with the PCB.
A method, comprising:
- receiving an enclosure configured to house a printed circuit board (PCB);
- determining one or more heat-producing locations on the PCB;
- attaching one or more dovetail rails to an interior wall of the enclosure at one or more locations, wherein the one or more locations are selected to align with the one or more heat-producing locations on the PCB.
Dependencies are inferred from the claim text.