H05K 2203/178
Demolishing
Official title: Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
H05K2203/178 (Demolishing) appears on 93 US grants and 113 published applications in this corpus.
Search patents in H05K- Granted patents
- 93
- Published applications
- 113
- Assignees
- 91
- Inventors
- 299
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 2 |
| 2003 | 2 | 3 |
| 2004 | 2 | 5 |
| 2005 | 2 | 2 |
| 2006 | 4 | 2 |
| 2007 | 1 | 3 |
| 2008 | 1 | 4 |
| 2009 | 2 | 4 |
| 2010 | 1 | 2 |
| 2011 | 3 | 2 |
| 2012 | 2 | 1 |
| 2013 | 3 | 14 |
| 2014 | 0 | 10 |
| 2015 | 7 | 6 |
| 2016 | 6 | 10 |
| 2017 | 6 | 7 |
| 2018 | 6 | 4 |
| 2019 | 7 | 3 |
| 2020 | 2 | 3 |
| 2021 | 4 | 2 |
| 2022 | 1 | 1 |
| 2023 | 2 | 4 |
| 2024 | 5 | 12 |
| 2025 | 5 | 4 |
| 2026 | 6 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solvent free copper extraction18 Aug 2026US 12,709,784 B2GreenSource Fabrication LLC
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Method, apparatus and system for processing a composite waste source26 May 2026US 12,637,737 B2NewSouth Innovations Pty Limited
- Self-healable, recyclable, and reconfigurable wearable electronics device14 Apr 2026US 12,604,398 B2The Regents of the University of Colorado, a body corporate
- Method of recycling integrated circuits3 Feb 2026US 12,541,746 B2Phinia Jersey Holdings LLC
- System and Method for Fastener Removal23 Jul 2026US 2026/0208245 A1Carnegie Mellon University
- Electronic device assembly with a biodegradable housing structure15 Jan 2026US 2026/0020164 A1
- Liquid metal-vitrimer composites25 Sep 2025US 2025/0299847 A1Virginia Tech Intellectual Properties, Inc.
- Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices11 Sep 2025US 2025/0282971 A1Ecole Polytechnique Federale De Lausanne (Epfl)
- Method of recycling integrated circuits14 Aug 2025US 2025/0259151 A1Phinia Jersey Holdings LLC
Most cited
By later US patents
- Method for recycling of obsolete printed circuit boards36US 9,215,813 B2Advanced Technology Materials, Inc. · 2015
- Method of growing electrically conductive tissue31US 9,253,889 B2Ecovative Design LLC · 2016
- Process for forming a pattern of metallurgy on the top of a ceramic substrate28US 4,546,065 AInternational Business Machines Corporation · 1985
- Method of and apparatus for disposing waste26US 6,568,612 B1Hitachi, Ltd. · 2003
- Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates23US 9,496,229 B2The Board of Trustees of the University of Illinois · 2016