Process for forming a pattern of metallurgy on the top of a ceramic substrate

A process for forming a pattern of conductive lines on the top of a multi-layer ceramic substrate comprising the steps of:

• providing a green ceramic substrate;
• embossing a pattern of grooves in the top surface of the green ceramic substrate;
• sintering the green ceramic substrate to thereby form a multi-layer ceramic substrate;
• depositing a conductive material in at least a portion of said embossed pattern of grooves, wherein said depositing comprises the steps of:
• glazing the top of said multi-layer ceramic substrate with a glazing material;
• wiping a colored substance in at least a portion of said embossed pattern of grooves;
• taking a photograph of the top of said multi-layer ceramic substrate;
• generating a mask from said photograph;
• and
• photolithographically depositing a conductive material on the top of said multi-layer ceramic substrate in accordance with the pattern of said mask and in said pattern of grooves using a photoresist formed by developing a deposited photoresist forming layer exposed through the mask, wherein subsequent to taking the photograph but prior to photolithographically depositing the conductive material the colored substance is removed form the embossed pattern of grooves.