H05K 2203/101
Using electrical induction
Official title: Using electrical induction, e.g. for heating during soldering
H05K2203/101 (Using electrical induction) appears on 63 US grants and 72 published applications in this corpus.
Search patents in H05K- Granted patents
- 63
- Published applications
- 72
- Assignees
- 63
- Inventors
- 207
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 2 |
| 2002 | 4 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 3 |
| 2008 | 0 | 2 |
| 2009 | 1 | 9 |
| 2010 | 1 | 8 |
| 2011 | 2 | 5 |
| 2012 | 3 | 4 |
| 2013 | 5 | 4 |
| 2014 | 5 | 4 |
| 2015 | 1 | 3 |
| 2016 | 2 | 6 |
| 2017 | 3 | 3 |
| 2018 | 1 | 1 |
| 2019 | 1 | 1 |
| 2020 | 2 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 3 | 2 |
| 2024 | 0 | 4 |
| 2025 | 1 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Stacked component array structure28 Oct 2025US 12,457,687 B2Tesla, Inc.
- Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board25 Apr 2023US 11,638,350 B2Mitsubishi Materials Corporation
- Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention17 Jan 2023US 11,558,964 B2International Business Machines Corporation
- Systems and methods for removing an adhesively-attached component from a circuit board assembly10 Jan 2023US 11,553,631 B2Raytheon Company
- System and method for manufacturing flexible laminated circuit boards18 Jan 2022US 11,229,126 B2Duetto Integrated Systems, Inc.
- Methods of assembling stacked printed circuit board component array22 Jan 2026US 2026/0025921 A1Tesla, Inc.
- Method of mounting electronic devices and partially shielded board for mounting electronic devices31 Oct 2024US 2024/0365523 A1National Institute of Advanced Industrial Science and Technology
- Manufacturing method of electronic device22 Aug 2024US 2024/0284601 A1FUJIFILM Corporation
- Electronic device and manufacturing method therefor30 May 2024US 2024/0179850 A1Bs Technics Co., Ltd.
- Stacked component array structure11 Jan 2024US 2024/0015887 A1Tesla, Inc.
Most cited
By later US patents
- Thermally assisted shorts removal process for glass ceramic product using an RF field149US 5,290,986 AInternational Business Machines Corporation · 1994
- Printed circuit board assembly having adhesive joint61US 6,384,339 B1Sheldahl, Inc. · 2002
- Localized soldering by inductive heating58US 4,983,804 AAT&T Bell Laboratories · 1991
- Multilevel circuit board precision positioning48US 5,008,619 AAMP-AKZO Corporation · 1991
- Flexible etched circuit assembly35US 5,605,477 AThe Whitaker Corporation · 1997