Manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• preparing an electronic substrate including a wiring board, an electronic component disposed on the wiring board, and a ground electrode;
• forming an insulating layer on the electronic component;
• and
• forming, on the insulating layer and on the ground electrode, an electromagnetic wave shielding layer that covers the insulating layer and is electrically connected to the ground electrode, to obtain an electronic device,
• wherein, the forming an insulating layer includes jetting an ink for an insulating layer, which is an active energy ray curable-type ink and has a viscosity at 25° C. of 12 mPa·s to 35 mPa·s, from an ink jet head A to apply the ink for an insulating layer onto the electronic component, and performing an irradiation with active energy ray on the applied ink for an insulating layer,
• the forming an electromagnetic wave shielding layer includes jetting an ink for an electromagnetic wave shielding layer, which contains at least one metal compound selected from the group consisting of a metal salt and a metal complex, from an ink jet head B to apply the ink for an electromagnetic wave shielding layer onto the insulating layer and onto the ground electrode, and performing at least one of a heating or an irradiation with active energy ray on the applied ink for an electromagnetic wave shielding layer, and
• a jetting temperature in the jetting of the ink for an insulating layer from the ink jet head A is higher than a jetting temperature in the jetting of the ink for an electromagnetic wave shielding layer from the ink jet head B by 10° C. to 40° C.