Systems and methods for removing an adhesively-attached component from a circuit board assembly

A system for removing an adhesively-attached component from a circuit board assembly, the system comprising:

• a complementary pair of magnetic field channeling members configured to be positioned on opposite sides of the circuit board assembly about the adhesively-attached component, the complementary pair of high-permeability members having a central pedestal and a peripheral pedestal, the central pedestal configured to direct a magnetic field induced therein through the adhesively-attached component, the peripheral pedestal configured to provide a return path for the magnetic field about a periphery of the adhesively-attached component, wherein the complementary pair of magnetic field channeling members are made of magnetically permeable materials that have a magnetic permeability sufficient to facilitate channeling of any magnetic fields induced within the magnetic field channeling members therein;
• an inductive coil circumscribing the central pedestal of the complementary pair of magnetic field channeling members;
• and
• a coil driver configured to generate an AC current in the inductive coil circumscribing the central pedestal, thereby inducing the magnetic field therein.