Stacked component array structure
AssigneeTesla, Inc.
InventorsJin Zhao, Satyan Chandra, Shishuang Sun
Life of this patent
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Abstract
A structure with an electronic component array positioned between two stacked printed circuit boards (600,606) is disclosed. The electronic components (502) of the array can be connected to the printed circuit board (600,606) by way of solder connections. Example electronic components (502) include capacitors. Related methods of manufacture are disclosed that involve applying heat to a solder paste array on a printed circuit board (600,606) to form solid conductors electrically connected to the electronic components (502).
Claims18
A stacked Printed Circuit Board (PCB) electronic component array structure comprising:
- a first PCB;
- a second PCB, the second PCB being stacked with the first PCB;
- and
- an electronic component array comprising a plurality of electronic components positioned between the first PCB and the second PCB, the electronic component array comprising a plurality of capacitors, the plurality of electronic components being electrically coupled to the first PCB by way of a first conductive strip connections and being electrically coupled to the second PCB by way of second conductive strip connections, wherein a first conductive strip connection of the first conductive strip connections provides a shared electrical connection between a group of capacitors of the plurality of capacitors and the first PCB.
A stacked Printed Circuit Board (PCB) electronic component array structure comprising:
- a first PCB;
- a second PCB, the second PCB being stacked with the first PCB;
- and
- a two-dimensional electronic component array comprising a plurality of electronic components positioned between the first PCB and the second PCB, the plurality of electronic components being electrically coupled to the first PCB by way of first solder connections and being electrically coupled to the second PCB by way of second solder connections, wherein a first common solder connection of the first solder connections electrically connects a group of electronic components of the plurality of electronic components to the first PCB, and wherein a second common solder connection of the second solder connections electrically connects the group of electronic components of the plurality of electronic components to the second PCB.
A voltage regulator module comprising:
- a first printed circuit board (PCB);
- a second PCB, the second PCB being stacked with the first PCB;
- and
- a two-dimensional capacitor array positioned between the first PCB and the second PCB, wherein a first common solder connection electrically connects a group of capacitors of the two-dimensional capacitor array to the first PCB,
- wherein the voltage regulator module is configured to receive a voltage and convert the voltage to a lower voltage.
Dependencies are inferred from the claim text.