H05K 2203/081
Blowing of gas
Official title: Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
H05K2203/081 (Blowing of gas) appears on 239 US grants and 185 published applications in this corpus.
Search patents in H05K- Granted patents
- 239
- Published applications
- 185
- Assignees
- 163
- Inventors
- 561
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 13 | 0 |
| 2001 | 15 | 8 |
| 2002 | 17 | 12 |
| 2003 | 8 | 8 |
| 2004 | 7 | 17 |
| 2005 | 8 | 13 |
| 2006 | 5 | 8 |
| 2007 | 7 | 12 |
| 2008 | 5 | 6 |
| 2009 | 2 | 8 |
| 2010 | 5 | 5 |
| 2011 | 4 | 7 |
| 2012 | 2 | 3 |
| 2013 | 6 | 5 |
| 2014 | 3 | 10 |
| 2015 | 2 | 9 |
| 2016 | 8 | 7 |
| 2017 | 6 | 4 |
| 2018 | 6 | 6 |
| 2019 | 3 | 5 |
| 2020 | 8 | 8 |
| 2021 | 13 | 10 |
| 2022 | 6 | 4 |
| 2023 | 2 | 2 |
| 2024 | 3 | 3 |
| 2025 | 2 | 1 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole1 Jul 2025US 12,349,287 B2Pac Tech—Packaging Technologies GmbH
- Method and apparatus for flexible circuit cable attachment31 Dec 2024US 12,185,476 B2Jabil Inc.
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole2 Jul 2024US 12,028,987 B2Pac Tech—Packaging Technologies GmbH
- Mechatronic curtain for a process chamber for carrying out thermal processes in the manufacture of electronic assemblies20 Feb 2024US 11,910,539 B2Rehm Thermal Systems GmbH
- Method for manufacturing conductive film and conductive film20 Aug 2026US 2026/0241712 A1Ricoh Company, Ltd.
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Dispensing heater and methods of use9 Apr 2026US 2026/0101446 A1Nano Dimension Technologies, Ltd.
- Reflow oven2 Apr 2026US 2026/0092741 A1Illinois Tool Works Inc.
- Portable baking assembly to cure thermal interface material for processing units8 May 2025US 2025/0151251 A1Zt Group Int'l, Inc. Dba Zt Systems
Most cited
By later US patents
- Method and apparatus for solder sphere placement using an air knife146US 5,431,332 AMotorola, Inc. · 1995
- Blind via laser drilling system115US 6,211,485 B12001
- Blind via laser drilling system91US 6,631,558 B2Laservia Corporation · 2003
- Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement81US 5,516,030 ACompaq Computer Corporation · 1996
- Spraying and dispensing apparatus80US 6,068,202 APrecision Valve & Automotion, Inc. · 2000