H05K 2203/0139
Blade or squeegee
Official title: Blade or squeegee, e.g. for screen printing or filling of holes
H05K2203/0139 (Blade or squeegee) appears on 212 US grants and 210 published applications in this corpus.
Search patents in H05K- Granted patents
- 212
- Published applications
- 210
- Assignees
- 130
- Inventors
- 487
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 3 |
| 2002 | 7 | 11 |
| 2003 | 7 | 5 |
| 2004 | 7 | 9 |
| 2005 | 7 | 7 |
| 2006 | 4 | 3 |
| 2007 | 4 | 11 |
| 2008 | 5 | 6 |
| 2009 | 4 | 13 |
| 2010 | 9 | 8 |
| 2011 | 4 | 4 |
| 2012 | 6 | 4 |
| 2013 | 0 | 5 |
| 2014 | 1 | 11 |
| 2015 | 9 | 9 |
| 2016 | 8 | 11 |
| 2017 | 9 | 9 |
| 2018 | 8 | 12 |
| 2019 | 9 | 13 |
| 2020 | 7 | 15 |
| 2021 | 9 | 12 |
| 2022 | 8 | 3 |
| 2023 | 10 | 14 |
| 2024 | 5 | 6 |
| 2025 | 12 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Stencil mask and stencil printing method27 Jan 2026US 12,538,433 B2
- Paste retainer systems and methods for use in paste printing systems14 Oct 2025US 12,440,910 B2Transition Automation, Inc.
- Application of electrical conductors to an electrically insulating substrate14 Oct 2025US 12,446,160 B2Landa Labs (2012) Ltd.
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Printing process assistance system7 May 2026US 2026/0124831 A1Yamaha Hatsudoki Kabushiki Kaisha
- Method for forming stencil mask7 May 2026US 2026/0129765 A1STATS ChipPAC Pte. Ltd.
- System and Method for Sintering Structures on a Base5 Mar 2026US 2026/0061485 A1Inari Technology Sdn Bhd
- Wiping device for stencil printer29 Jan 2026US 2026/0027819 A1Illinois Tool Works Inc.
- Pattern-printed thick film roll and method for manufacturing pattern-printed thick film roll21 Aug 2025US 2025/0267797 A1Nissha Co., Ltd.
Most cited
By later US patents
- Method of packing filler into through-holes in a printed circuit board49US 5,268,194 ANippon CMK Corp. · 1993
- Solder applying mechanism42US 5,044,306 A1991
- Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials38US 5,637,176 AFry's Metals, Inc. · 1997
- Automatic squeegee angle and pressure adjusting means31US 5,479,854 AMatsushita Electric Industrial Co., Ltd. · 1996
- Method and apparatus for forming solder bumps30US 6,276,599 B1Noda Screen Co., Ltd. · 2001