Method of packing filler into through-holes in a printed circuit board

Abstract

A method of packing filler into through-holes in a printed circuit board is disclosed. The method comprises steps of packing the filler through a mask into the through-holes and at the same time smoothing protrusions of the filler at the upper and lower openings of the through-holes by means of squeegees. In this method, the mask may be a silk screen provided with open-worked packing holes for packing the filler in the positions corresponding to those in which the through-holes of said printed circuit board are packed. In the above method, the filler may be packed by delivering pressurized filler from a packing nozzle, which comprises 1) a packing means connected both to a manipulation means for actuating a delivery valve for delivering the filler from said nozzle tip and to a supply means for supplying the filler and 2) a nozzle tip attached to the delivery end of said packing nozzle. In the above-described method, said filler may be a solvent-less filler.

Dependencies are inferred from the claim text.