H05K 2201/056
Folded around rigid support or component
H05K2201/056 (Folded around rigid support or component) appears on 666 US grants and 781 published applications in this corpus.
Search patents in H05K- Granted patents
- 666
- Published applications
- 781
- Assignees
- 371
- Inventors
- 1,620
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 2 |
| 2002 | 4 | 5 |
| 2003 | 4 | 7 |
| 2004 | 5 | 14 |
| 2005 | 7 | 22 |
| 2006 | 7 | 36 |
| 2007 | 13 | 34 |
| 2008 | 18 | 27 |
| 2009 | 30 | 32 |
| 2010 | 19 | 20 |
| 2011 | 19 | 18 |
| 2012 | 15 | 17 |
| 2013 | 10 | 13 |
| 2014 | 17 | 19 |
| 2015 | 12 | 26 |
| 2016 | 13 | 29 |
| 2017 | 26 | 36 |
| 2018 | 31 | 50 |
| 2019 | 49 | 59 |
| 2020 | 61 | 87 |
| 2021 | 69 | 65 |
| 2022 | 38 | 50 |
| 2023 | 46 | 50 |
| 2024 | 52 | 33 |
| 2025 | 46 | 18 |
| 2026 | 11 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible circuits configured for heat spreading in a wearable display25 Aug 2026US 12,720,667 B2Google Inc.
- Conformable thin film-based strain sensing with flexible substrate11 Aug 2026US 12,704,421 B2The Regents of the University of Michigan
- Flexible connector with reduced torsional stiffness7 Jul 2026US 12,677,057 B2Cambridge Mechatronics Limited
- Lens drive device, and lens barrel and camera equipped with same28 Apr 2026US 12,613,455 B2Panasonic Intellectual Property Management Co., Ltd.
- Flexible wiring board and light control unit31 Mar 2026US 12,593,398 B2Toppan Inc.
- Electronic device17 Sep 2026US 2026/0280098 A1Huawei Technologies Co., Ltd.
- Wire harness6 Aug 2026US 2026/0229860 A1Yazaki Corporation
- Wire harness6 Aug 2026US 2026/0231341 A1Yazaki Corporation
- Flexible circuit board, cof module, and electronic device including same30 Jul 2026US 2026/0223285 A1LG Innotek Co., Ltd.
- Wire harness and wire harness manufacturing method16 Jul 2026US 2026/0204458 A1Yazaki Corporation
Most cited
By later US patents
- Flexible circuit sheet274US 9,226,689 B2Medtronic Xomed, Inc. · 2016
- Flexible printed circuit with removable testing portion238US 9,717,141 B1St. Jude Medical, Atrial Fibrillation Division, Inc. · 2017
- Semiconductor package with flexible board and method of fabricating the same157US 5,805,422 ANEC Corporation · 1998
- Liquid crystal display device with reduced frame portion surrounding display area127US 5,739,887 AHitachi Device Engineering Co., Ltd. · 1998
- Semiconductor module with imbedded heat spreader126US 6,449,159 B1Rambus Inc. · 2002