H05K 13/0817
Monitoring of soldering processes
Official title: {Monitoring of soldering processes (inspection of solder joints or of printed solder paste G01N21/95684)}
H05K13/0817 (Monitoring of soldering processes) appears on 77 US grants and 82 published applications in this corpus.
Search patents in H05K- Granted patents
- 77
- Published applications
- 82
- Assignees
- 43
- Inventors
- 200
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 3 |
| 2003 | 1 | 1 |
| 2004 | 2 | 2 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 1 |
| 2008 | 1 | 3 |
| 2009 | 1 | 1 |
| 2010 | 0 | 2 |
| 2011 | 1 | 0 |
| 2012 | 4 | 4 |
| 2013 | 0 | 1 |
| 2014 | 1 | 6 |
| 2015 | 1 | 6 |
| 2016 | 4 | 5 |
| 2017 | 3 | 4 |
| 2018 | 7 | 2 |
| 2019 | 2 | 7 |
| 2020 | 7 | 7 |
| 2021 | 4 | 4 |
| 2022 | 8 | 9 |
| 2023 | 2 | 2 |
| 2024 | 4 | 4 |
| 2025 | 5 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for automated monitoring of a soldering process, soldering device with monitoring device14 Apr 2026US 12,603,467 B2ERSA GmbH
- System for determining contamination coefficients and/or degrees of contamination in particular during the reflow soldering of printed circuit boards, and associated evaluation unit14 Oct 2025US 12,446,203 B2ERSA GmbH
- Solder printing inspection device30 Sep 2025US 12,432,895 B2Ckd Corporation
- Inspection device and inspection method for detecting formation of a solder bridge over adjacent electrodes24 Jun 2025US 12,342,468 B2Fuji Corporation
- Correction amount calculating device17 Jun 2025US 12,336,109 B2Fuji Corporation
- Real-time pcba monitoring and alert system30 Jul 2026US 2026/0223345 A1
- Solder stencil design with inspection-based feedback11 Jun 2026US 2026/0164630 A1Siemens Industry Software Inc.
- Self correcting wave soldering machine6 Feb 2025US 2025/0041958 A1
- Information processing system, non-transitory computer readable medium, and information processing method24 Oct 2024US 2024/0354926 A1FUJIFILM Business Innovation Corp.
- Method for automated monitoring of a soldering process, soldering device with monitoring device25 Jul 2024US 2024/0250488 A1ERSA GmbH
Most cited
By later US patents
- Method and apparatus for inspection of solder joints utilizing shape determination from shading79US 5,064,291 AHughes Aircraft Company · 1991
- Illumination device for indirectly illuminating an object with continuous diffuse light57US 5,604,550 ANortheast Robotics LLC · 1997
- Ring illumination reflective elements on a generally planar surface45US 5,828,449 AAcuity Imaging, LLC · 1998
- Appearance inspection apparatus and appearance inspection method of electronic components43US 5,686,994 AMatsushita Electric Industrial Co., Ltd. · 1997
- Inspecting device for inspecting printed state of cream solder40US 5,450,204 ASharp Kabushiki Kaisha · 1995