Method for automated monitoring of a soldering process, soldering device with monitoring device

A soldering device (10) for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) in a manual soldering process, with an energy dissipation (E) and a device position (Px,y,z) and/or a device acceleration (ax,y,z), wherein the soldering device (10) in a soldering state (130), in which the soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction and/or by heat radiation and/or by heat convection, has a first energy dissipation (E) and a first device position (Px,y,z) and/or a first device acceleration (ax,y,z), wherein the soldering device (10) in a handling state (120), in which the soldering device (10) is moved towards and/or away from the soldering point (20) has a second energy dissipation (E) and/or a second device position (Px,y,z) and/or a second device acceleration (ax,y,z),

• wherein the soldering device (10) additionally has a monitoring device (30) for monitoring a state of the soldering point (20) and/or of the substrate (12) and/or of the component (14), and wherein the monitoring device (30) is set up to determine the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) depending on a time series of the energy dissipation (E) and/or a time series of the device position (Px,y,z) and/or a time series of the device acceleration (ax,y,z).