Solder stencil design with inspection-based feedback

A system comprising:

• a memory system configured to store computer-executable instructions;
• and
• a computing system, in response to execution of the computer-executable instructions, is configured to:
• receive measurements of solder paste disposed on a printed circuit board using a solder paste stencil;
• correlate the measurements of the solder paste disposed on the printed circuit board to a solder stencil design describing the solder paste stencil utilized during an application of the solder paste on the printed circuit board;
• and
• detect a cause of a production defect associated with the printed circuit board based, at least in part, on the correlation of the measurements of the solder paste disposed on the printed circuit board to the solder stencil design.

An apparatus comprising at least one computer-readable memory device storing instructions configured to cause one or more processing devices to perform operations comprising:

• receiving measurements of solder paste disposed on a printed circuit board using a solder paste stencil;
• correlating the measurements of the solder paste disposed on the printed circuit board to a solder stencil design describing the solder paste stencil utilized during an application of the solder paste on the printed circuit board;
• and
• detecting a cause of a production defect associated with the printed circuit board based, at least in part, on the correlation of the measurements of the solder paste disposed on the printed circuit board to the solder stencil design.