H05K 13/0815
Controlling of component placement on the substrate during or after manufacturing
Official title: {Controlling of component placement on the substrate during or after manufacturing}
H05K13/0815 (Controlling of component placement on the substrate during or after manufacturing) appears on 264 US grants and 226 published applications in this corpus.
Search patents in H05K- Granted patents
- 264
- Published applications
- 226
- Assignees
- 120
- Inventors
- 550
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 5 |
| 2002 | 6 | 11 |
| 2003 | 9 | 3 |
| 2004 | 6 | 3 |
| 2005 | 4 | 8 |
| 2006 | 6 | 6 |
| 2007 | 4 | 2 |
| 2008 | 1 | 1 |
| 2009 | 3 | 6 |
| 2010 | 4 | 4 |
| 2011 | 0 | 2 |
| 2012 | 1 | 8 |
| 2013 | 4 | 3 |
| 2014 | 5 | 7 |
| 2015 | 4 | 9 |
| 2016 | 6 | 5 |
| 2017 | 1 | 8 |
| 2018 | 6 | 19 |
| 2019 | 8 | 23 |
| 2020 | 29 | 26 |
| 2021 | 19 | 10 |
| 2022 | 26 | 23 |
| 2023 | 10 | 13 |
| 2024 | 11 | 10 |
| 2025 | 18 | 5 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Systems and methods for printed circuit board netlist extraction from multimodal imagery5 May 2026US 12,620,242 B2Battelle Memorial Institute
- Component mounting system10 Feb 2026US 12,550,308 B2Yamaha Hatsudoki Kabushiki Kaisha
- Malfunction determining device and malfunction determining method for component mounting machine6 Jan 2026US 12,520,468 B2Fuji Corporation
- Inspection device20 Aug 2026US 2026/0243701 A1Saki Corporation
- Electronic component mounting system and electronic component mounting inspection method20 Aug 2026US 2026/0247593 A1Fuji Corporation
- Systems and methods for printed circuit board netlist extraction from multimodal imagery13 Aug 2026US 2026/0237225 A1
- Component mounting apparatus and determination method25 Jun 2026US 2026/0181848 A1Fuji Corporation
- Mounting device15 Jan 2026US 2026/0020211 A1Toray Engineering Co., Ltd.
Most cited
By later US patents
- Apparatus and method for inspection of high component density printed circuit board156US 5,455,870 ARaytheon Company · 1995
- Method and apparatus for chip placement150US 4,980,971 AAT&T Bell Laboratories · 1991
- Robotic system for mounting electrical components69US 4,628,464 AWestinghouse Electric Corp. · 1986
- Vacuum clamping detection method and vacuum clamping detector66US 7,263,890 B2Koganei Corporation · 2007
- Method of and apparatus for inspecting mounting of chip components60US 4,978,224 ASharp Kabushiki Kaisha · 1990