Malfunction determining device and malfunction determining method for component mounting machine

A component mounting machine including a malfunction determining device comprising:

• a head including a pickup member for picking up a component,
• a moving device configured to move the head,
• an inspection section including circuitry configured to
• execute a first inspection for performing a mounting operation under control of the head and the moving device to inspect whether the mounting operation is good or bad by sequentially mounting multiple components of the same type on an inspection board by sequentially picking up and mounting the multiple components by the pickup member by the pickup member and detecting a positional deviation of each mounted component, and
• execute a second inspection for performing a calibration measurement of the head to inspect whether the calibration measurement is good or bad by placing a jig nozzle in the head, controlling the moving device so that the jig nozzle is disposed above a camera and lifting the jig nozzle so that the jig nozzle is located in a lifting end in a vertical direction, and lowering the jig nozzle so that the jig nozzle is located in a lowering end in the vertical direction, and controlling the camera to image a reference mark on the jig nozzle when the jig nozzle is located in the lifting end and located in the lowering end and measuring a positional deviation amount of the reference mark between the images when the jig nozzle is located in the lifting end and located in the lowering end, and
• a determining section including circuitry configured to determine presence or absence of a malfunction in the head and the moving device and determine a malfunction location in the head or the moving device based on a combination of results of the first and second inspections.