H04R 1/06
Arranging circuit leads
Official title: Arranging circuit leads; Relieving strain on circuit leads
H04R1/06 (Arranging circuit leads) appears on 711 US grants and 916 published applications in this corpus.
Search patents in H04R- Granted patents
- 711
- Published applications
- 916
- Assignees
- 343
- Inventors
- 1,507
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 4 |
| 2002 | 5 | 13 |
| 2003 | 10 | 15 |
| 2004 | 17 | 36 |
| 2005 | 9 | 25 |
| 2006 | 17 | 31 |
| 2007 | 19 | 31 |
| 2008 | 13 | 18 |
| 2009 | 12 | 14 |
| 2010 | 13 | 19 |
| 2011 | 15 | 20 |
| 2012 | 18 | 22 |
| 2013 | 17 | 25 |
| 2014 | 23 | 30 |
| 2015 | 21 | 38 |
| 2016 | 39 | 40 |
| 2017 | 52 | 49 |
| 2018 | 38 | 54 |
| 2019 | 39 | 34 |
| 2020 | 46 | 56 |
| 2021 | 43 | 54 |
| 2022 | 33 | 42 |
| 2023 | 40 | 48 |
| 2024 | 51 | 57 |
| 2025 | 40 | 71 |
| 2026 | 22 | 70 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method of assembling a loudspeaker and voice coil former for use therein1 Sep 2026US 12,726,778 B2Pss Belgium NV
- Sound output device25 Aug 2026US 12,720,246 B2Sony Group Corporation
- Speaker that vibrates diaphragm11 Aug 2026US 12,707,204 B2JVCKENWOOD Corporation
- Worksite audio device28 Jul 2026US 12,696,018 B2Milwaukee Electric Tool Corporation
- Glasses24 Sep 2026US 2026/0287935 A1Shenzhen Shokz Co., Ltd.
- Glasses24 Sep 2026US 2026/0287936 A1Shenzhen Shokz Co., Ltd.
- Glasses24 Sep 2026US 2026/0287937 A1Shenzhen Shokz Co., Ltd.
- High and low dual-frequency composite loudspeaker unit and audio device24 Sep 2026US 2026/0292402 A1Shenzhen Weile Electronics Co.Ltd
- Electronic module group17 Sep 2026US 2026/0276187 A1Lumien Enterprise, Inc.
Most cited
By later US patents
- Integrated electroacoustic transducer145US 4,533,795 AAmerican Telephone and Telegraph Company · 1985
- Silicon based condenser microphone and packaging method for the same118US 7,903,831 B2BSE Co., Ltd. · 2011
- Transducer device and assembly101US 8,000,491 B2Nokia Corporation · 2011
- Fully integrated amplified loudspeaker67US 6,243,472 B12001
- Flexible PCB voice coil connector61US 7,447,327 B2Star Micronics Co., Ltd. · 2008