US 8,000,491 B2Granted

Transducer device and assembly

AssigneeNokia Corporation

InventorsPanu Brodkin, Tapio Liusvaara

Life of this patent

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Abstract

The invention concerns a transducer device and assembly. A transducer device and assembly according to the invention comprise sheet of electrical insulator covering connection pads of a transducer component. The sheet of electrical insulator has on its surface connection pads that have galvanic contacts with the connection pads of the transducer component. Inside or on a surface of the sheet of electrical insulator there are electrical conductors connected with the connection pads of the sheet of electrical insulator. With the aid of the sheet of electrical insulator equipped with the connection pads and electrical conductors the transducer component can be mounted to a wiring board in a desired orientation, i.e. the connection pads of the transducer component do not need to be against the wiring board.

Claims46

Dependent claims

An apparatus comprising:

a transducer component having at least one connection pad on a first region of a surface of said transducer component, where said transducer component is configured to convert input energy in a first form into output energy of a second different form,
a sheet of electrical insulator disposed to be folded around said transducer component, at least a part of a surface of a first side of said sheet of electrical insulator being against at least a part of the surface of said transducer component,
at least one first connection pad on the surface of the first side of said sheet of electrical insulator, said at least one first connection pad being against said at least one connection pad of said transducer component and having a galvanic contact with said at least one connection pad of said transducer component,
at least one second connection pad on a surface of a second side of said sheet of electrical insulator, and
at least one electrical conductor being in contact with said sheet of electrical insulator and adapted to form a galvanic connection between said at least one first connection pad and said at least one second connection pad.

2 more elements

A transducer assembly comprising:

a wiring board having an aperture,
a transducer component having at least one connection pad on a first region of a surface of said transducer component and a signal aperture on a second region of the surface of said transducer component, said second region being on an opposite side of said transducer component with respect to said first region, said second region facing towards said wiring board, and said signal aperture being aligned with said aperture of said wiring board,
a sheet of electrical insulator disposed to cover at least partly said first region of the surface of said transducer component, at least part of a surface of a first side of said sheet of electrical insulator being against said first region of the surface of said transducer component,
at least one first connection pad on the surface of the first side of said sheet of electrical insulator, said at least one first connection pad being against said at least one connection pad of said transducer component and having a galvanic contact with said at least one connection pad of said transducer component, and
at least one electrical conductor being in contact with said sheet of electrical insulator and adapted to have a galvanic contact with said at least one first connection pad.

2 more elements

A communication device comprising:

a wiring board having an aperture,
a transducer component having at least one connection pad on a first region of a surface of said transducer component and a signal aperture on a second region of the surface of said transducer component, said second region being on an opposite side of said transducer component with respect to said first region, said second region facing towards said wiring board, and said signal aperture being aligned with said aperture of said wiring board,
a sheet of electrical insulator disposed to cover at least partly said first region of the surface of said transducer component, at least part of a surface of a first side of said sheet of electrical insulator being against said first region of the surface of said transducer component,
at least one first connection pad on the surface of the first side of said sheet of electrical insulator, said at least one first connection pad being against said connection pad of said transducer component and having a galvanic contact with said connection pad of said transducer component, and
at least one electrical conductor being in contact with said sheet of electrical insulator and adapted to have a galvanic contact with said at least one first connection pad.

2 more elements

A method comprising:

installing a sheet of electrical insulator around a transducer component, at least a part of a surface of a first side of said sheet of electrical insulator getting against a first side of said transducer component and at least one first connection pad on the surface of the first side of said sheet of electrical insulator getting against at least one connection pad at said first side of said transducer component, where the sheet of electrical insulator extends over a second side of the transducer component and past a third side of, said transducer component, and
producing a galvanic contact between said at least one first connection pad and said at least one connection pad of said transducer component.

Dependencies are inferred from the claim text.

Facts

Application: 11/585,717Filed 24 Oct 2006
Published: US 2008/0094753 A124 Apr 2008
Granted: 16 Aug 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 1/147
Structural association of two or more printed circuits: at least one of the printed circuits being bent or folded, e.g. by using a flexible…
H04R 1/06
Details of transducers, loudspeakers or microphones: arranging circuit leads; Relieving strain on circuit leads
H05K 1/0243
High frequency adaptations: printed circuits associated with mounted high frequency components
H05K 1/141
Structural association of two or more printed circuits: one or more single auxiliary printed circuits mounted on a main printed circuit, e.g.…