Fully integrated amplified loudspeaker

A loudspeaker device comprising:

• a magnetic assembly having a magnetic gap;
• a former;
• a voice coil wound around said former and positioned in said magnetic gap;
• a first inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled in series with said voice coil;
• a second inductive component a) wound around a portion of said former positioned outside of said magnetic gap, b) electrically coupled in series with said voice coil and c) electrically coupled to said first inductive component through said voice coil;
• a first capacitive component electrically coupled between said first inductive component and said voice coil;
• a second capacitive component electrically coupled between said second inductive component and said voice coil;
• a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;
• and
• an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input, a first output and a second output,
• wherein said first output of said amplifier circuit is electrically coupled to said voice coil through said first inductive component and said second output of said amplifier circuit is electrically coupled to said voice coil through said second inductive component.

A loudspeaker device comprising:

• a magnetic assembly having a magnetic gap;
• a former;
• a voice coil wound around said former and positioned in said magnetic gap;
• a first inductive component wound around a portion of said former positioned outside of said magnetic gap and electrically coupled in series with said voice coil;
• a second inductive component a) wound around a portion of said former positioned outside of said magnetic gap, b) electrically coupled in series with said voice coil and c) electrically coupled to said first inductive component through said voice coil;
• a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;
• and
• an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input, a first output and a second output,
• wherein said first output of said amplifier circuit is electrically coupled to said voice coil through said first inductive component and said second output of said amplifier circuit is electrically coupled to said voice coil through said second inductive component.

A loudspeaker device comprising:

• a magnetic assembly having a magnetic gap;
• a former;
• a voice coil wound around said former and positioned in said magnetic gap;
• a substrate mounted on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;
• and
• an amplifier circuit thermally coupled to said layer of thermally conductive material and comprising an input and a first output,
• wherein said first output of said amplifier circuit is electrically coupled to said voice coil.

A loudspeaker device comprising:

• a magnetic assembly having a magnetic gap;
• a former;
• a voice coil wound around said former and positioned in said magnetic gap;
• a substrate mounted on at least one inside surface of said magnetic assembly, said sustrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;
• and
• an amplifier circuit a) residing inside of said magnetic assembly, b) thermally coupled to said layer of thermally conductive material c) comprising an input, and d) comprising a first output electrically coupled to said voice coil.

A method for convection cooling an amplifier circuit, including an input and an output, in a loudspeaker device utilizing a) a magnetic assembly having a magnetic gap with an associated magnetic field and b) a voice coil wound around a former and positioned in said magnetic gap, said method comprising the steps of:

• mounting a substrate on said former, said substrate comprising a layer of thermally conductive material, and a layer of electrically conductive traces;
• thermally coupling said amplifier circuit to said layer of thermally conductive material;
• and
• electrically coupling said output of said amplifier to said voice coil;
• whereby said former, said voice coil, said substrate and said amplifier circuit move in response to a voltage applied by said output of said amplifier circuit to said voice coil interacting with said magnetic field resulting in said convection cooling of said amplifier circuit.