H03H 9/0547
Consisting of a vertical arrangement
Official title: {consisting of a vertical arrangement (H03H9/0566 takes precedence)}
H03H9/0547 (Consisting of a vertical arrangement) appears on 1,101 US grants and 1,221 published applications in this corpus.
Search patents in H03H- Granted patents
- 1,101
- Published applications
- 1,221
- Assignees
- 189
- Inventors
- 1,476
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 9 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 13 | 0 |
| 2001 | 15 | 6 |
| 2002 | 14 | 18 |
| 2003 | 11 | 20 |
| 2004 | 18 | 38 |
| 2005 | 21 | 38 |
| 2006 | 29 | 30 |
| 2007 | 25 | 41 |
| 2008 | 23 | 32 |
| 2009 | 27 | 34 |
| 2010 | 29 | 33 |
| 2011 | 32 | 41 |
| 2012 | 38 | 36 |
| 2013 | 36 | 36 |
| 2014 | 36 | 45 |
| 2015 | 44 | 53 |
| 2016 | 38 | 35 |
| 2017 | 35 | 41 |
| 2018 | 39 | 74 |
| 2019 | 62 | 90 |
| 2020 | 68 | 96 |
| 2021 | 80 | 76 |
| 2022 | 70 | 83 |
| 2023 | 63 | 99 |
| 2024 | 70 | 75 |
| 2025 | 68 | 34 |
| 2026 | 50 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Vibrator device with semiconductor element and vibrator22 Sep 2026US 12,744,510 B2Seiko Epson Corporation
- Vibrator device and method for manufacturing vibrator device15 Sep 2026US 12,738,921 B2Seiko Epson Corporation
- Acoustic wave device and module including the same25 Aug 2026US 12,719,442 B2Sanan Japan Technology Corporation
- Vibrator device4 Aug 2026US 12,698,966 B2Seiko Epson Corporation
- Vibrator device14 Jul 2026US 12,683,573 B2Seiko Epson Corporation
- Stress isolated bulk acoustic wave resonator dies1 Oct 2026US 2026/0303056 A1
- Electronic component24 Sep 2026US 2026/0291462 A1TDK Corporation
- Filter structure integrated with ipd chip, packaging module, and manufacturing method13 Aug 2026US 2026/0240052 A1Vanchip (Tianjin) Technology Co., Ltd.
- Stacked structure with multiple acoustic wave devices6 Aug 2026US 2026/0230057 A1Skyworks Solutions, Inc.
- Integrated devices with multiple acoustic resonator chiplets30 Jul 2026US 2026/0221955 A1QUALCOMM Incorporated
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Surface acoustic wave devices having a guard layer350US 5,699,027 AMatsushita Electric Industrial Co., Ltd. · 1997
- Method of assembling a wafer-level package filter288US 7,596,849 B1TriQuint Semiconductor, Inc. · 2009
- Method for manufacturing a vibrating MEMS circuit263US 9,369,105 B1RF Micro Devices, Inc. · 2016
- Surface acoustic wave resonator, surface acoustic wave oscillator, and surface acoustic wave module unit243US 8,344,815 B2Seiko Epson Corporation · 2013