H01P 3/18
Built-up from several layers to increase operating surface, i.e. alternately conductive and
Official title: built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
H01P3/18 (Built-up from several layers to increase operating surface, i.e. alternately conductive and) appears on 28 US grants and 32 published applications in this corpus.
Search patents in H01P- Granted patents
- 28
- Published applications
- 32
- Assignees
- 23
- Inventors
- 96
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 2 |
| 2015 | 1 | 0 |
| 2016 | 2 | 4 |
| 2017 | 1 | 2 |
| 2018 | 3 | 3 |
| 2019 | 3 | 4 |
| 2020 | 4 | 2 |
| 2021 | 1 | 1 |
| 2022 | 3 | 0 |
| 2023 | 0 | 2 |
| 2024 | 0 | 0 |
| 2025 | 2 | 4 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Waveguide components of waveguides formed with additive manufacturing30 Dec 2025US 12,512,574 B2Raytheon Company
- Electronic device comprising first and second metal patterns arranged with first and second insulating patterns in a specified configuration22 Jul 2025US 12,368,222 B2Innolux Corporation
- Waveguide device having multiple layers, where through going empty holes are in each layer and are offset in adjoining layers for leakage suppression8 Nov 2022US 11,495,871 B2Metasum AB
- Stacked transmission line21 Jun 2022US 11,369,020 B2Invensas Corporation
- Free-form dual dual-conductor integrated radio frequency media24 May 2022US 11,342,647 B2Raytheon Company
- Coupler, butler matrix circuit, transmitting circuit, and transmitting device1 Oct 2026US 2026/0302585 A1Sumitomo Electric Industries, Ltd.
- Wiring and electronic apparatus14 May 2026US 2026/0135016 A1Sony Semiconductor Solutions Corporation
- Waveguide assembly for use with launcher-in-package devices8 Jan 2026US 2026/0011902 A1NXP B. V.
- Flexible printed circuit cable30 Oct 2025US 2025/0338395 A1Microsoft Technology Licensing, LLC
- Electronic device11 Sep 2025US 2025/0286260 A1Innolux Corporation
Most cited
By later US patents
- Thin film multilayered electrode of high frequency electromagnetic field coupling115US 6,148,221 AMurata Manufacturing Co., Ltd. · 2000
- Directional coupler21US 10,622,696 B2Nidec Corporation · 2020
- Waveguide device having multiple layers, where through going empty holes are in each layer and are offset in adjoining layers for leakage suppression21US 11,495,871 B2Metasum AB · 2022
- Thin-film multilayered electrode and method of fabricating same11US 5,770,988 AMurata Manufacturing Co., Ltd. · 1998
- Multi-layer thin-film electrode, for a high-frequency transmission line, resonator, and filter8US 5,920,243 AMurata Manufacturing Co., Ltd. · 1999