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US 11,369,020 B2Granted
Stacked transmission line
AssigneeInvensas Corporation
InventorsShaowu Huang, Javier A. Delacruz, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
A stacked, multi-layer transmission line is provided. The stacked transmission line includes at least a pair of conductive traces, each conductive trace having a plurality of conductive stubs electrically coupled thereto. The stubs are disposed in one or more separate spatial layers from the conductive traces.
Claims18
A multi-layer microelectronic structure, comprising:
- a first conductive trace disposed at a first spatial layer of a carrier or a package, the first conductive trace being coplanar to the first spatial layer;
- a second conductive trace disposed at the first spatial layer, parallel to and coplanar to the first conductive trace, the first and second conductive traces comprising a transmission line;
- a first plurality of conductive stubs disposed at a second spatial layer of the carrier or the package below and parallel to the first spatial layer, the first plurality of conductive stubs is electrically coupled to the first conductive trace and extends linearly from below the first conductive trace to below the second conductive trace, wherein each stub of the first plurality of conductive stubs is overlapped by the first conductive trace and is overlapped by the second conductive trace without being mechanically coupled to the second conductive trace, each stub of the first plurality of conductive stubs forms a capacitor with the second conductive trace;
- a second plurality of conductive stubs disposed at the second spatial layer of the carrier or the package and is electrically coupled to the second conductive trace and extends linearly from below the second conductive trace to below the first conductive trace, wherein each stub of the second plurality of conductive stubs is overlapped by the second conductive trace and is overlapped by the first conductive trace without being mechanically coupled to the first conductive trace, each stub of the second plurality of conductive stubs forms a capacitor with the first conductive trace, wherein the stubs of the second plurality of conductive stubs are parallel to the stubs of the first plurality of conductive stubs in an alternating interlaced pattern, the first and second pluralities of conductive stubs being adapted to increase a capacitive coupling between the first and second conductive traces based on an arrangement and an orientation of the first and second pluralities of conductive stubs;
- and
- at least a first conductive segment disposed at the second spatial layer and adjacent to the first conductive trace and at least a second conductive segment disposed at the second spatial layer and adjacent to the second conductive trace.
3 more elements
A method of fabricating a multi-layer microelectronic structure, comprising:
- forming a transmission line, including:
- forming a first conductive trace at a first spatial layer of a carrier or a package, the first conductive trace being coplanar to the first spatial layer;
- forming a second conductive trace at the first spatial layer, parallel to and coplanar to the first conductive trace, the first and second conductive traces comprising the transmission line;
- and
- increasing a capacitive coupling between the first and second conductive traces, including:
- forming a first plurality of conductive stubs at a second spatial layer of the carrier or the package below and parallel to the first spatial layer, the first plurality of conductive stubs extending linearly from below the first conductive trace to below the second conductive trace, wherein each stub of the first plurality of conductive stubs is overlapped by the first conductive trace and is overlapped by the second conductive trace without being mechanically coupled to the second conductive trace, each stub of the first plurality of conductive stubs forms a capacitor with the second conductive trace;
- electrically coupling the first plurality of conductive stubs to the first conductive trace;
- forming a second plurality of conductive stubs at the second spatial layer of the carrier or the package, the second plurality of conductive stubs extending linearly from below the second conductive trace to below the first conductive trace, wherein each stub of the second plurality of conductive stubs is overlapped by the second conductive trace and is overlapped by the first conductive trace without being mechanically coupled to the first conductive trace, each stub of the second plurality of conductive stubs forms a capacitor with the first conductive trace, wherein the stubs of the second plurality of conductive stubs are parallel to the stubs of the first plurality of conductive stubs in an alternating interlaced pattern;
- electrically coupling the second plurality of conductive stubs to the second conductive trace;
- and
- forming at least a first conductive segment disposed at the second spatial layer and adjacent to the first conductive trace and at least a second conductive segment disposed at the second spatial layer and adjacent to the second conductive trace.
8 more elements
A multi-layer microelectronic structure, comprising:
- a first conductive trace disposed at a first spatial layer of a carrier or a package, the first conductive trace being coplanar to the first spatial layer;
- a second conductive trace disposed at the first spatial layer of the carrier or the package and coplanar to the first conductive trace, at least a portion of the second conductive trace parallel to the first conductive trace, the first and second conductive traces comprising a transmission line;
- one or more first conductive stubs disposed at a second spatial layer of the carrier or the package and electrically coupled to the first conductive trace, the second spatial layer different from the first spatial layer and the second spatial layer being parallel to the first spatial layer, at least a portion of each of the one or more first conductive stubs fully overlaps a segment of the first conductive trace in a plan view;
- one or more second conductive stubs disposed at a third spatial layer of the carrier or the package and electrically coupled to the second conductive trace, the third spatial layer different from the first spatial layer and the third spatial layer being parallel to the first spatial layer, at least a portion of each of the one or more second conductive stubs fully overlaps a segment of the second conductive trace in a plan view, the one or more first and second conductive stubs adapted to increase a capacitive coupling between the first and second conductive traces based on an arrangement and an orientation of the one or more first and second conductive stubs;
- and
- at least a first conductive segment disposed at the second spatial layer and adjacent to the first conductive trace and at least a second conductive segment disposed at the second spatial layer and adjacent to the second conductive trace.
3 more elements
A multi-layer microelectronic structure, comprising:
- a first conductive trace disposed at a first spatial layer of a carrier or a package, the first conductive trace being coplanar to the first spatial layer;
- a second conductive trace disposed at the first spatial layer of the carrier or the package and coplanar to the first conductive trace, at least a portion of the second conductive trace parallel to the first conductive trace, the first and second conductive traces comprising a transmission line;
- one or more first conductive stubs disposed at a second, different spatial layer of the carrier or the package and electrically coupled to the first conductive trace, at least a portion of each of the one or more first conductive stubs at least partially overlaps a portion of the first conductive trace in a plan view;
- one or more second conductive stubs disposed at the second spatial layer of the carrier or the package and electrically coupled to the second conductive trace, at least a portion of each of the one or more second conductive stubs at least partially overlaps a portion of the second conductive trace in a plan view;
- and
- at least a first conductive segment disposed at the second spatial layer and adjacent to the first conductive trace and at least a second conductive segment disposed at the second spatial layer and adjacent to the second conductive trace.
3 more elements
Dependencies are inferred from the claim text.