Electronic device comprising first and second metal patterns arranged with first and second insulating patterns in a specified configuration

An electronic device comprising:

• a substrate;
• a first metal pattern disposed on the substrate;
• a first insulating pattern disposed on the first metal pattern;
• and
• a second metal pattern comprising a first contact portion and a second contact portion, and disposed on the first metal pattern and the first insulating pattern,
• wherein in a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion,
• wherein in the cross-sectional view, an edge of the second metal pattern is recessed from an edge of the first metal pattern or exceeds the edge of the first metal pattern.

An electronic device comprising:

• a substrate;
• a first metal pattern disposed on the substrate and having a first skin depth;
• and
• a second metal pattern comprising a first contact portion and a second contact portion, disposed on the first metal pattern and having a second skin depth,
• wherein in a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and at least one of a width of the first contact portion in a first direction and a width of the second contact portion in a first direction is greater than or equal to a greater one of the first skin depth and the second skin depth.