H01P 3/023
Fin lines
Official title: {Fin lines; Slot lines}
H01P3/023 (Fin lines) appears on 37 US grants and 34 published applications in this corpus.
Search patents in H01P- Granted patents
- 37
- Published applications
- 34
- Assignees
- 30
- Inventors
- 104
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 2 |
| 2003 | 2 | 3 |
| 2004 | 1 | 3 |
| 2005 | 3 | 2 |
| 2006 | 2 | 0 |
| 2007 | 1 | 3 |
| 2008 | 1 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 3 |
| 2015 | 0 | 3 |
| 2016 | 2 | 0 |
| 2017 | 3 | 1 |
| 2018 | 0 | 0 |
| 2019 | 2 | 1 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 3 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip packages including substrate integrated waveguides16 Jun 2026US 12,658,550 B2Infineon Technologies AG
- Load pull tuner for waveguide wafer probe1 Apr 2025US 12,265,101 B1
- Component carrier and method of manufacturing a component carrier24 Dec 2024US 12,177,965 B2AT&SAustria Technologie & Systemtechnik AG
- Linear impedance compensation system with microstrip and slotline coupling and controllable capacitance30 Jan 2024US 11,888,238 B2NXP USA, Inc.
- Radio frequency antenna with varying impedance for wearable2 Jan 2024US 11,857,304 B1Amazon Technologies, Inc.
- Chip packages including substrate integrated waveguides3 Sep 2026US 2026/0261029 A1Infineon Technologies AG
- Radio frequency probe including a dielectric waveguide and a conducting transition member having an end portion with associated prongs16 Jul 2026US 2026/0204764 A1Redpoint Microwave, LLC
- Hybrid structure for ultra-widebandterahertz generation and reception with semiconductor devices7 Aug 2025US 2025/0253515 A1Universidad Carlos III De Madrid
- Marchand balun and frequency multiplier including the same26 Dec 2024US 2024/0429586 A1Electronics and Telecommunications Research Institute
- Chip packages including substrate integrated waveguides28 Nov 2024US 2024/0396198 A1Infineon Technologies AG
Most cited
By later US patents
- Fractal and space-filling transmission lines, resonators, filters and passive network elements33US 7,245,196 B1Fractus, S. A. · 2007
- High-frequency transmission line, dielectric resonator, filter, duplexer, and communication device, with an electrode having gaps in an edge portion20US 6,144,268 AMurata Manufacturing Co., Ltd. · 2000
- Transmission line, filter, duplexer and communication device19US 6,577,211 B1Murata Manufacturing Co., Ltd. · 2003
- Integrated capacitance structures in microwave finline devices16US 4,789,840 AHewlett-Packard Company · 1988
- Slot transmission line patch connector16US 7,116,190 B2Molex Incorporated · 2006