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US 12,177,965 B2Granted
Component carrier and method of manufacturing a component carrier
AssigneeAT&SAustria Technologie & Systemtechnik AG
InventorsSebastian Sattler, Christian Vockenberger, Ahmad Bader Alothman Alterkawi
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.
Claims18
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- wherein the at least one electrically conductive layer structure comprises a first trace;
- and
- wherein a tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace,
- wherein a bottom of the tapering trench is delimited by the at least one electrically conductive layer structure.
2 more elements
A method of manufacturing a component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming the at least one electrically conductive layer structure with a first trace;
- and
- forming a tapering trench in the at least one electrically insulating layer structure beside and below the first trace by removing material of the at least one electrically insulating layer structure using one of the at least one electrically conductive layer structure as a stop layer.
1 more element
Dependencies are inferred from the claim text.