G06F 7/381
Using cryogenic components
Official title: {using cryogenic components, e.g. Josephson gates}
G06F7/381 (Using cryogenic components) appears on 9 US grants and 5 published applications in this corpus.
Search patents in G06F- Granted patents
- 9
- Published applications
- 5
- Assignees
- 8
- Inventors
- 22
- Latest grant
- 21 May 2024
Filings by year
| Year | Granted patents | Published applications |
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| 1979 | 1 | 0 |
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| 2013 | 0 | 1 |
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| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 2 | 0 |
| 2021 | 0 | 2 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- System and method for forming solder bumps21 May 2024US 11,990,437 B2International Business Machines Corporation
- Calculating device5 Dec 2023US 11,836,458 B2Kabushiki Kaisha Toshiba
- Calculating device20 Dec 2022US 11,531,523 B2Kabushiki Kaisha Toshiba
- System and method for forming solder bumps29 Dec 2020US 10,879,202 B1International Business Machines Corporation
- Superconducting system architecture for high-performance energy-efficient cryogenic computing4 Feb 2020US 10,552,756 B2University of Rochester
- Calculating device28 Jul 2022US 2022/0236947 A1Kabushiki Kaisha Toshiba
- Calculating device26 Aug 2021US 2021/0263705 A1Kabushiki Kaisha Toshiba
- System and method for forming solder bumps28 Jan 2021US 2021/0028138 A1International Business Machines Corporation
- Superconducting system architecture for high-performance energy-efficient cryogenic computing20 Jun 2019US 2019/0188596 A1University of Rochester
- Binary half-adder using oscillators18 Apr 2013US 2013/0093458 A1Manchester Metropolitan University
Most cited
By later US patents
- DC-powered Josephson integrated circuit12US 5,124,583 AHitachi, Ltd. · 1992
- Logic circuit with asymmetrical quantum interferometric circuits11US 4,330,841 ANippon Telegraph & Telephone Public Corporation · 1982
- Superconducting system architecture for high-performance energy-efficient cryogenic computing6US 10,552,756 B2University of Rochester · 2020
- System and method for forming solder bumps5US 10,879,202 B1International Business Machines Corporation · 2020
- Binary half-adder using oscillators4US 8,928,353 B2Manchester Metropolitan University · 2015