G06F 2119/02
Reliability analysis or reliability optimisation
Official title: Reliability analysis or reliability optimisation; Failure analysis, e.g. worst case scenario performance, failure mode and effects analysis [FMEA]
G06F2119/02 (Reliability analysis or reliability optimisation) appears on 353 US grants and 589 published applications in this corpus.
Search patents in G06F- Granted patents
- 353
- Published applications
- 589
- Assignees
- 328
- Inventors
- 2,013
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 5 |
| 2003 | 1 | 2 |
| 2004 | 0 | 4 |
| 2005 | 3 | 1 |
| 2006 | 3 | 2 |
| 2007 | 1 | 4 |
| 2008 | 2 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 2 |
| 2013 | 2 | 3 |
| 2014 | 2 | 3 |
| 2015 | 2 | 8 |
| 2016 | 6 | 9 |
| 2017 | 7 | 4 |
| 2018 | 6 | 11 |
| 2019 | 9 | 10 |
| 2020 | 22 | 31 |
| 2021 | 37 | 65 |
| 2022 | 43 | 105 |
| 2023 | 63 | 99 |
| 2024 | 61 | 89 |
| 2025 | 41 | 92 |
| 2026 | 36 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Machine learning based metrology for semiconductor specimens6 Oct 2026US 12,754,484 B2Applied Materials Israel Ltd.
- Configuration of patterning process6 Oct 2026US 12,755,081 B2ASML Netherlands B. V.
- Method and system for simulating and verifying layout based on distribution22 Sep 2026US 12,743,571 B2Samsung Electronics Co., Ltd.
- Chip design method using secondary development capability of EDA software15 Sep 2026US 12,737,517 B2Batelab Co., Ltd.
- Casing treatment system and method8 Sep 2026US 12,729,696 B2Purdue Research Foundation
- Rapid online evaluation method for credibility of equipment digital twin integrated evolution model8 Oct 2026US 2026/0310857 A1Beihang University
- Merged-height cell semiconductor device structure and methods of forming same1 Oct 2026US 2026/0300603 A1Samsung Electronics Co., Ltd.
- Artificial intelligence-based automated wiring and plug-and-play electrical architecture for engineer-to-order manufacturing systems17 Sep 2026US 2026/0278201 A1
- Physics-Based Design for Automatic Assembly17 Sep 2026US 2026/0278223 A1Bright Machines, Inc.
- Early-Stage Integrated Circuit Electrostatic Discharge Safeguarding17 Sep 2026US 2026/0278231 A1Google Inc.
Most cited
By later US patents
- Method of designing a turbine blade outer air seal43US 6,393,331 B1United Technologies Corporation · 2002
- 3D stack of accelerator die and multi-core processor die31US 11,694,940 B1Kepler Computing Inc. · 2023
- Error recovery in a computer aided design environment31US 6,888,542 B1Autodesk, Inc. · 2005
- Building quality indexing system30US 11,308,247 B2Archneura Inc. · 2022
- System integrated fault-tree analysis methods (SIFTAN)29US 4,870,575 AITT Corporation · 1989