G05B 2219/45033
Wire bonding, wire wrap
G05B2219/45033 (Wire bonding, wire wrap) appears on 26 US grants and 16 published applications in this corpus.
Search patents in G05B- Granted patents
- 26
- Published applications
- 16
- Assignees
- 21
- Inventors
- 56
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 3 |
| 2002 | 1 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 4 |
| 2021 | 0 | 0 |
| 2022 | 2 | 1 |
| 2023 | 3 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Position control apparatus, position control method, position control recording medium, and bonding apparatus26 May 2026US 12,638,830 B2Yamaha Robotics Co., Ltd.
- Automated fiber bundle placement apparatus25 Jul 2023US 11,707,841 B2Tsudakoma Kogyo Kabushiki Kaisha
- Automated machine for inserting wires into grommet cavity locations of an electrical connector and methods of operating30 May 2023US 11,662,713 B2The Boeing Company
- Method for calibrating an ultrasonic bonding machine9 May 2023US 11,646,291 B2Infineon Technologies AG
- Wire harness production supporting device and wire harness production supporting method19 Jul 2022US 11,393,611 B2Hitachi Metals, Ltd.
- Position control apparatus, position control method, position control recording medium, and bonding apparatus31 Aug 2023US 2023/0273599 A1Kabushiki Kaisha Shinkawa
- Automated fiber bundle placement apparatus13 Jan 2022US 2022/0009094 A1Tsudakoma Kogyo Kabushiki Kaisha
- Wire harness production supporting device and wire harness production supporting method10 Sep 2020US 2020/0286651 A1Hitachi Metals, Ltd.
- Methods of operating an automated machine for inserting wires into grommet cavity locations of an electrical connector23 Jul 2020US 2020/0233404 A1The Boeing Company
- Robot system and coupling method11 Jun 2020US 2020/0180157 A1Seiko Epson Corporation
Most cited
By later US patents
- Wire bonding apparatus39US 4,266,710 AKulicke and Soffa Industries, Inc. · 1981
- Bonding apparatus with means and method for automatic calibration using pattern recognition36US 4,759,073 AKulicke and Soffa Industries, Inc. · 1988
- High speed wire bonding method34US 4,340,166 AKulicke and Soffa Industries, Inc. · 1982
- Wire bonding apparatus33US 4,444,349 AKulicke and Soffa Industries, Inc. · 1984
- wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus27US 5,060,841 AHitachi, Ltd. · 1991