Position control apparatus, position control method, position control recording medium, and bonding apparatus

A position control method comprising:

• an imaging step of causing each of a first imaging unit and a second imaging unit supported by a head unit to image a reference indicator set on a stage or a target object placed on the stage;
• a calculation step of calculating three-dimensional coordinates of the reference indicator based on a first indicator image which is an image of the reference indicator captured in a first image outputted by the first imaging unit, and a second indicator image which is an image of the reference indicator captured in a second image outputted by the second imaging unit;
• a calculation step of calculating placement coordinates for placing a die from the three-dimensional coordinates;
• and
• a driving step of causing a tool unit supported by the head unit and placing the die on the target object to approach or separate from the target object based on the placement coordinates,
• wherein the three-dimensional coordinates denote a position of the reference indicator with a reference position of the head unit taken as an origin.

A position control non-transitory recording medium that stores a program and causes a computer to execute:

• an imaging step of causing each of a first imaging unit and a second imaging unit supported by a head unit to image a reference indicator set on a stage or a target object placed on the stage;
• a calculation step of calculating three-dimensional coordinates of the reference indicator based on a first indicator image which is an image of the reference indicator captured in a first image outputted by the first imaging unit, and a second indicator image which is an image of the reference indicator captured in a second image outputted by the second imaging unit;
• a calculation step of calculating placement coordinates for placing a die from the three-dimensional coordinates;
• and
• a driving step of causing a tool unit supported by the head unit and placing the die on the target object to approach or separate from the target object based on the placement coordinates,
• wherein the three-dimensional coordinates denote a position of the reference indicator with a reference position of the head unit taken as an origin.

A bonding apparatus comprising:

• a bonding tool placing and bonding a semiconductor chip to a mounting region of a substrate placed on a stage;
• a first imaging unit imaging a reference indicator which is set on the stage or the substrate and outputting a first image;
• a second imaging unit imaging the reference indicator and outputting a second image;
• a head unit supporting the bonding tool, the first imaging unit, and the second imaging unit;
• a calculation unit calculating three-dimensional coordinates of the reference indicator based on a first indicator image which is an image of the reference indicator captured in the first image, and a second indicator image which is an image of the reference indicator captured in the second image, wherein the calculation unit is configured to calculate placement coordinates for placing the semiconductor chip from the three-dimensional coordinates;
• and
• a drive control unit causing the bonding tool holding the semiconductor chip to approach or separate from the mounting region based on the placement coordinates,
• wherein the three-dimensional coordinates denote a position of the reference indicator with a reference position of the head unit taken as an origin.