Wire bonding apparatus

A method of setting the high speed limits of travel of a wire bonding tool for a wire bonder of the type having a processor controlled Z drive motor, comprising the steps of:

• moving the bonding tool downward to engage a wire bonding target on a semiconductor,
• sensing the first point of engagement of said bonding tool with said semiconductor to establish the bonding position,
• recording said sensed first point of engagement in said processor,
• calculating a tolerance inflection point at a predetermined distance from said first point of engagement representative of the start of constant velocity approach to said bonding position,
• raising said bonding tool,
• lowering said bonding tool downward to engage a fixed member,
• sensing the second point of engagement of said bonding tool with said fixed member,
• recording said sensed second point of engagement of said bonding tool with said fixed member, and
• calculating a reset point at a predetermined distance from said second point of engagement representative of the start of rapid acceleration approach to said second bonding position.