High speed wire bonding method
AssigneeKulicke and Soffa Industries, Inc.
InventorsGlenn B. Bilane, Lawrence M. Rubin, Albert Soffa, Dan Vilenski
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AssigneeKulicke and Soffa Industries, Inc.
InventorsGlenn B. Bilane, Lawrence M. Rubin, Albert Soffa, Dan Vilenski
Estimating the term…
A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode, the bonding tool is moved toward the electrode at a substantially linear predetermined velocity so that the bonding tool imparts a controlled kinetic energy to the wire as a first bonding force, a second predetermined preload bonding force is applied to the bonding tool at the time of engagement and subsequently a third and final predetermined bonding force is applied to the bonding tool to bond the fine wire to the electrode at high speeds.
A method for high speed bonding fine wire to a semiconductor device comprising the step of:
Dependencies are inferred from the claim text.