G05B 2219/32231
Inspection and correction, repair station in one unit, correction data in memory
G05B2219/32231 (Inspection and correction, repair station in one unit, correction data in memory) appears on 5 US grants and 4 published applications in this corpus.
Search patents in G05B- Granted patents
- 5
- Published applications
- 4
- Assignees
- 5
- Inventors
- 9
- Latest grant
- 19 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Repair welding system, repair welding method, inspection device, and robot control device19 Nov 2024US 12,145,219 B2Panasonic Intellectual Property Management Co., Ltd.
- Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program14 Jun 2011US 7,960,187 B2Tokyo Electron Limited
- Automated semiconductor wafer salvage during processing29 Apr 2008US 7,364,922 B2Tokyo Electron Limited
- Manufacturing system and method27 May 2003US 6,571,145 B1Globus Technical Equipment, Ltd.
- Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering6 Aug 1996US 5,542,600 AOMRON Corporation
- Repair welding system, repair welding method, inspection device, and robot control device30 Jan 2025US 2025/0033149 A1Panasonic Intellectual Property Management Co., Ltd.
- Repair welding system, repair welding method, inspection device, and robot control device21 Apr 2022US 2022/0118558 A1Panasonic Intellectual Property Management Co., Ltd.
- Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program18 Sep 2008US 2008/0223298 A1Tokyo Electron Limited
- Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program27 Jul 2006US 2006/0162660 A1Tokyo Electron Limited
Most cited
By later US patents
- Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering22US 5,542,600 AOMRON Corporation · 1996
- Manufacturing system and method14US 6,571,145 B1Globus Technical Equipment, Ltd. · 2003
- Automated semiconductor wafer salvage during processing7US 7,364,922 B2Tokyo Electron Limited · 2008