Automated semiconductor wafer salvage during processing
AssigneeTokyo Electron Limited
InventorNoriaki Shimizu
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AssigneeTokyo Electron Limited
InventorNoriaki Shimizu
Estimating the term…
The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.
A recovery processing method to be adopted in a substrate processing apparatus equipped with a plurality of chambers including at least a processing chamber where a substrate transferred from a substrate storage container undergoes processing, to restore said substrate processing apparatus to an operating state after correcting an abnormality having occurred in said substrate processing apparatus in operation and having resulted in a stop in the operation, comprising:
A recovery processing method to be adopted in a substrate processing apparatus equipped with a processing unit constituted with a plurality of chambers including at least a plurality of processing chambers where substrates are processed, a transfer unit connected to the processing unit, which includes a transfer chamber where said substrates are transferred to/from a substrate storage container for storing said substrates, a transfer unit-side transfer mechanism disposed inside said transfer unit to carry said substrates into/out of the processing unit and a processing unit-side transfer mechanism disposed inside said processing unit to carry said substrates into/out of said processing chambers, to restore said substrate processing apparatus to an operating state after correcting an abnormality having occurred in said substrate processing apparatus in operation and having resulted in an operation stop, comprising:
A recovery processing method to be adopted in a substrate processing apparatus equipped with a transfer unit that includes a transfer chamber where the substrates are transferred to/from a substrate storage container for storing said substrates, a processing unit that includes a plurality of processing chambers where said substrates are processed connected around a common transfer chamber and a load-lock chamber that connects said common transfer chamber to said transfer chamber of said transfer unit;
A substrate processing apparatus that processes substrates, comprising:
A substrate processing apparatus that processes substrates, comprising:
A program used to execute recovery processing for a substrate processing apparatus equipped with a plurality of chambers including at least a processing chamber where a substrate transferred from a substrate storage container undergoes processing, to restore said substrate processing apparatus to an operating state after correcting an abnormality having occurred in said substrate processing apparatus in operation and having resulted in a stop in the operation, which enables a computer to execute;
Dependencies are inferred from the claim text.