Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

A method of providing information to an automatic soldering apparatus, comprising the steps of:

• storing soldering condition information in first memory means for each classification of parts;
• storing identification codes of parts, which are to be mounted on a board in second memory means for each board;
• entering an identification code of a board;
• and
• with regard to a board whose identification code has been entered, reading identification codes for all parts that are to be mounted on the board from said second memory means, reading soldering condition information of classifications to which the read parts belong from said first memory means, and storing the read part identification codes and the read soldering condition information in correlated form in a soldering-condition data table.

A soldering inspection apparatus comprising:

• inspecting means for discriminating soldering quality and positions of parts mounted on a board to detect soldering defects;
• first memory means for storing information corresponding to parts that have been mounted on the board;
• second memory means for storing correction condition information necessary for correcting faulty soldered locations for each classification of parts;
• and
• means for reading, when a soldering defect of a part has been detected by said inspecting means, correction condition information that corresponds to a classification to which the part belongs from said second memory means, and creating correction data by correlating position information representing the location at which the soldering defect has been discriminated and the read correction condition information.

A soldering inspection apparatus comprising:

• memory means in which information identifying parts mounted on a board, criteria data for discriminating soldering quality of the parts and correction condition information necessary for correcting faulty soldered locations relating to the parts are stored in correlated form;
• inspecting means for discriminating soldering quality and positions of the parts that have been mounted on the board in accordance with the criteria data stored in said memory means to detect a soldering defect;
• and
• means for reading, when a soldering defect of a part has been detected by said inspecting means, correction condition information that corresponds to the part from said memory means, and means for creating correction data by correlating position information representing a location at which the soldering defect has been detected and the read correction condition information.

A soldering inspection apparatus comprising:

• inspecting means for discriminating soldering quality and positions of parts mounted on a board to detect soldering defects;
• memory means for storing information identifying parts mounted on the board and correction condition information necessary for correcting faulty soldered locations relating to the parts in correlated form;
• and
• means for reading when a soldering defect of a part has been detected by said inspecting means, correction condition information that corresponds to the part from said memory means,
• and means for creating correction data by correlating position information representing a location at which the soldering defect has been discriminated and the read correction condition information.

A soldering inspection method comprising the steps of:

• storing information identifying parts that have been mounted on a board in first memory means;
• storing correction condition information necessary for correcting a faulty soldered location in second memory means in advance for each classification of parts;
• discriminating soldering quality and positions of the parts mounted on the board to detect soldering defects;
• and
• when a soldering defect of a part has been detected, reading correction condition information that corresponds to a classification to which the part belongs from said second memory means and creating correction data by correlating position information representing the location at which the soldering defect has been detected and the read correction condition information.

A soldering inspection method comprising the steps of:

• storing, in memory means in correlated form, information about parts mounted on a board, criteria data for discriminating soldering quality of the parts and correction condition information necessary for correcting faulty soldered locations relating to the parts;
• discriminating soldering quality and positions of the parts mounted on the board in accordance with the criteria data stored in said memory means to defect a soldering defect;
• and
• when a soldering defect of a part has been detected, reading correction condition information that corresponds to the part from said memory means, and creating correction data by correlating position information representing a location at which the soldering defect has been detected and the read correction condition information.

A soldering inspection method comprising the steps of:

• storing, in memory means in correlated form, information about parts mounted on a board and correction condition information necessary for correcting faulty soldered locations relating to the parts;
• discriminating soldering quality and positions of the parts mounted on the board to detect a soldering defect for a part;
• and
• when a soldering defect for a part has been detected, reading correction condition information that corresponds to the part from said memory means and creating correction data by correlating position information representing a location at which the soldering defect has been detected and the read correction condition information.

An automatic soldering correction apparatus comprising:

• first memory means for storing correction condition information necessary for correcting faulty soldered locations for each classification of parts;
• second memory means for storing information identifying mounted parts on a board;
• third memory means for storing a corresponding relationship between the parts and part classifications to which the parts belong;
• means for reading correction condition information suited to a mounted part from said first memory means upon referring to the corresponding relationship stored in said third memory means;
• and
• means for creating a correction-condition information table in which the parts and correction condition information corresponding thereto are correlated.

An automatic soldering correction apparatus comprising:

• first memory means for storing correction condition information necessary for correcting faulty soldered locations for each classification of parts;
• second memory means for storing a corresponding relationship between parts and part classifications to which the parts belong;
• inspection-result input means for entering position information for a faulty soldered location with regard to a part having a faulty soldered location on a board on which the part is mounted;
• and
• soldering correcting means for reading correction condition information that corresponds to the part having the faulty soldered location for which the position information has been entered by said inspection-result input means from said first memory means upon referring to the corresponding relationship stored in said second memory means, and executing a soldering correction operation of the faulty soldered location of the mounted part on the board in accordance with the read correction condition information.

An automatic soldering correction method comprising the steps of:

• storing correction condition information necessary for correcting faulty soldered locations in first memory means for each classification of parts;
• storing information about mounted parts mounted on a board in second memory means;
• displaying information about the mounted parts that has been stored in said second memory means on a display unit;
• entering a part classification to which the parts corresponding to the displayed information belong;
• reading correction condition information that corresponds to the entered part classification from said first memory means and creating a correction-condition information table in which the displayed parts and the read correction condition information are correlated;
• giving information about a part having a faulty soldered location on a board on which the part has been mounted along with position information for the faulty location;
• reading correction condition information that corresponds to the given part having the faulty location from said correction-condition information table;
• and
• executing a soldering correction operation of the faulty location in accordance with the read correction condition information.

An automatic soldering correction method comprising the steps of:

• storing correction condition information necessary for correcting faulty soldered locations in memory means for each classification of parts;
• giving information about a part having a faulty soldered location on a board on which the part has been mounted and position information of the faulty location;
• reading correction condition information that corresponds to the given part having the faulty location from said memory means;
• and
• executing a soldering correction operation of the faulty location in accordance with the read correction condition information.

An automatic soldering apparatus comprising:

• first memory means for storing soldering condition information in correspondence with parts;
• second memory means for storing information relating to parts to be mounted on a board for each board;
• input means for entering an identification code of a board;
• and
• means for reading, with regard to a board whose identification code has been entered by said input means, information about all parts that are to be mounted on the board from said second memory means, reading soldering condition information suited to the read parts from said first memory means, and creating a soldering-condition data table indicating correlation between the board, the parts to be mounted on the board and the soldering condition information suited to the parts.

An automatic soldering correction apparatus comprising:

• first memory means for storing correction condition information necessary for correcting faulty soldered locations in correspondence with parts;
• a second memory means for storing information relating to mounted parts on a board on which parts are mounted;
• means for reading correction condition information suited to a mounted part on the board from said first memory means and creating a correction-condition information table in which the parts on the board and correction condition information corresponding thereto are correlated;
• inspection-result input means for entering position information for a faulty soldered location with regard to a part having a faulty soldered location on the board on which the part is mounted;
• and
• soldering correcting means for reading correction condition information that corresponds to the part having the faulty soldered location for which the position information has been entered by said inspection-result input means from said correction-condition information table, and executing a soldering correction operation of the faulty soldered location of the mounted part on the board in accordance with the read correction condition information.

An automatic soldering correction apparatus comprising:

• first memory means for storing correction condition information necessary for correcting faulty soldered locations in correspondence with parts;
• inspection-result input means for entering position information of a faulty soldered location with regard to a part having a faulty soldered location on the board on which the part is mounted;
• and
• soldering correcting means for reading correction condition information, which corresponds to the part having the faulty soldered location for which the position information has been entered by said inspection-result input means from said memory means, and executing a soldering correction operation of the faulty soldered location of the mounted part on the board in accordance with the read correction condition information.