US 7,960,187 B2 · Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program

Abstract

The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

Claims40

Dependent claims

A substrate processing apparatus that processes a processing target substrate, comprising:

at least one processing chamber where the substrate is processed;
a storage means for storing substrate processing history information with respect to processing executed on the substrate while the substrate processing apparatus is engaged in operation;
and
a control means for restoring the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a substrate processing stop, wherein:
said control means executes substrate salvage processing for the substrate left in said processing chamber in correspondence to the extent to which the substrate has been processed at the time of said processing stop detected based upon said processing history information stored in said storage means.

2 more elements

A recovery processing method to be adopted in a substrate processing apparatus equipped with at least one processing chamber where a processing target substrate is processed to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in an operation stop, wherein substrate salvage processing is executed, the method comprising:

a processing extent detection step in which the extent to which the substrate remaining in said processing chamber has been processed at the time of said processing stop is detected based upon processing history information stored in a storage means;
and
a substrate salvage step in which substrate salvage processing is executed for the substrate in correspondence to said processing extent having been detected through said processing extent detection step.

Dependencies are inferred from the claim text.

Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program

Life of this patent

Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program

Life of this patent

Abstract

Claims40