G01L 9/005
Non square semiconductive diaphragm
Official title: {Non square semiconductive diaphragm}
G01L9/005 (Non square semiconductive diaphragm) appears on 17 US grants and 19 published applications in this corpus.
Search patents in G01L- Granted patents
- 17
- Published applications
- 19
- Assignees
- 22
- Inventors
- 55
- Latest grant
- 17 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 2 |
| 2013 | 2 | 1 |
| 2014 | 0 | 3 |
| 2015 | 2 | 2 |
| 2016 | 0 | 3 |
| 2017 | 4 | 2 |
| 2018 | 2 | 2 |
| 2019 | 2 | 0 |
| 2020 | 1 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 2 | 1 |
By publication year.
Recent patents
- Micromechanical pressure sensor device including a diaphragm system and corresponding manufacturing method17 Oct 2023US 11,788,912 B2Robert Bosch GmbH
- Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (MEMS) sensor chip and preparation method thereof27 Jun 2023US 11,686,637 B2Xi' An Jiaotong University
- Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge15 Feb 2022US 11,248,976 B2Sciosense B. V.
- Method of manufacturing physical quantity sensor device and physical quantity sensor device1 Dec 2020US 10,852,318 B2Fuji Electric Co., Ltd.
- Semiconductor pressure sensor26 Mar 2019US 10,239,747 B2Mitsubishi Electric Corporation
- Piezoelectric micromachined pressure transducer with high sensitivity and related manufacturing process30 Nov 2023US 2023/0381816 A1STMicroelectronics S,r.l.
- Silicon carbide-based combined temperature-pressure micro-electro-mechanical system (mems) sensor chip and preparation method thereof12 May 2022US 2022/0146352 A1Xi' An Jiaotong University
- Micromechanical pressure sensor device and corresponding manufacturing method15 Jul 2021US 2021/0215559 A1Robert Bosch GmbH
- Capacitive Pressure Sensors and Other Devices Having a Suspended Membrane and Having Rounded Corners at an Anchor Edge5 Nov 2020US 2020/0348198 A1Sciosense B. V.
- Method of manufacturing physical quantity sensor device and physical quantity sensor device23 Aug 2018US 2018/0238928 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Pressure sensor and microphone26US 8,973,446 B2Kabushiki Kaisha Toshiba · 2015
- MEMS pressure sensor using capacitive technique6US 8,334,159 B1Advanced NuMicro Systems, Inc. · 2012
- Differential pressure sensor with a capacitive read out system5US 9,726,561 B2ams International AG · 2017
- Capacitance type pressure sensor and method for manufacturing a capacitance type pressure sensor3US 8,601,879 B2Rohm Co., Ltd. · 2013
- Pressure sensor and microphone3US 9,759,618 B2Kabushiki Kaisha Toshiba · 2017