F28F 3/022
The means being wires or pins
Official title: {the means being wires or pins}
F28F3/022 (The means being wires or pins) appears on 298 US grants and 373 published applications in this corpus.
Search patents in F28F- Granted patents
- 298
- Published applications
- 373
- Assignees
- 235
- Inventors
- 868
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 9 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 2 |
| 2002 | 10 | 10 |
| 2003 | 9 | 7 |
| 2004 | 8 | 11 |
| 2005 | 8 | 12 |
| 2006 | 5 | 11 |
| 2007 | 5 | 21 |
| 2008 | 3 | 6 |
| 2009 | 7 | 10 |
| 2010 | 8 | 14 |
| 2011 | 4 | 15 |
| 2012 | 7 | 14 |
| 2013 | 6 | 14 |
| 2014 | 10 | 12 |
| 2015 | 7 | 10 |
| 2016 | 9 | 23 |
| 2017 | 11 | 21 |
| 2018 | 8 | 25 |
| 2019 | 20 | 24 |
| 2020 | 17 | 20 |
| 2021 | 22 | 14 |
| 2022 | 12 | 18 |
| 2023 | 15 | 19 |
| 2024 | 13 | 16 |
| 2025 | 9 | 19 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Designs and applications of a low-drag, high-efficiency microchannel polymer heat exchanger6 Oct 2026US 12,753,981 B2The Regents of the University of California
- Integrated heat dissipation module structure12 May 2026US 12,628,314 B2Top Rank Technology Limited
- Three-dimensional heat transfer device14 Apr 2026US 12,601,549 B2Purple Cloud Development Pte. Ltd.
- Thermal transfer structures for immersion cooling7 Apr 2026US 12,598,724 B2Microsoft Technology Licensing, LLC
- Temperature regulation unit and method for manufacturing temperature regulation unit10 Feb 2026US 12,550,291 B2Tomoegawa Co., Ltd.
- Three-dimensional heat transfer device13 Aug 2026US 2026/0235366 A1Purple Cloud Development Pte. Ltd.
- Additively manufactured parts and structures with fins and methods of manufacturing the same6 Aug 2026US 2026/0225177 A1Blue Origin Manufacturing, LLC
- Closed-loop liquid cooler with pin-fins7 May 2026US 2026/0129793 A1Amulaire Thermal Technology, Inc.
- Bridged pin array for improved stiffness7 May 2026US 2026/0129812 A1Denso Corporation
- Vapor chamber and electronic device1 Jan 2026US 2026/0002737 A1Honor Device Co., Ltd.
Most cited
By later US patents
- Heat sink for cooling a heat producing element and application411US 5,504,650 AFujitsu Limited · 1996
- Fluid-cooled heat sink with turbulence-enhancing support pins195US 6,729,383 B1The United States of America as represented by the Secretary of the Navy · 2004
- Liquid cooling device for a high-power semiconductor module133US 5,978,220 AAsea Brown Boveri AG · 1999
- Flexible heat exchangers for medical cooling and warming applications130US 7,077,858 B2Coolhead Technologies, Inc. · 2006
- Fiber adhesive material85US 7,132,161 B2Energy Science Laboratories, Inc. · 2006