Three-dimensional heat transfer device
AssigneePurple Cloud Development Pte. Ltd.
InventorsXue Mei WANG, Xiao Min ZHANG
Life of this patent
Estimating the term…
Abstract
A heat transfer device includes a first thermally conductive casing configured to contact a heat source and a second casing mounted thereon to define a liquid-tight chamber. A thermally conductive protrusion extends into the chamber. First and second capillary structures are disposed on the first casing and the protrusion, respectively, and are thermally coupled. A first heat pipe extends through the second casing and is in fluid communication with the chamber. A second heat pipe extends through the second casing, is isolated from the chamber, and is spaced from the first casing.
Claims20
A heat transfer device, comprising:
- a first thermally conductive casing having a bottom plate and an outer surface configured to be in thermal contact with a heat source;
- a second thermally conductive casing mounted on the first thermally conductive casing, the first thermally conductive casing and the second thermally conductive casing together defining a liquid-tight chamber;
- a thermally conductive protrusion protruding from the first thermally conductive casing into the liquid-tight chamber;
- a first capillary structure disposed on the first thermally conductive casing;
- a second capillary structure disposed on the thermally conductive protrusion and thermally coupled with the first capillary structure;
- a first heat pipe extending through a first through hole of the second thermally conductive casing and contacting the second capillary structure, the first heat pipe including a first chamber in fluid communication with the liquid-tight chamber;
- and
- a second heat pipe extending through a second through hole of the second thermally conductive casing, the second heat pipe including a second chamber not in fluid communication with the liquid-tight chamber, wherein the second heat pipe is spaced apart from the first thermally conductive casing.
A heat transfer device, comprising:
- a first thermally conductive casing having a bottom plate;
- a second thermally conductive casing mounted on the first thermally conductive casing to define a liquid-tight chamber;
- a thermally conductive protrusion disposed within the liquid-tight chamber;
- a first capillary structure disposed on the first thermally conductive casing;
- a second capillary structure disposed on the thermally conductive protrusions;
- a first heat pipe disposed through a first through hole of the second thermally conductive casing and contacting the second capillary structure, the first heat pipe including a chamber in fluid communication with the liquid-tight chamber;
- and
- a second heat pipe disposed through a second through hole of the second thermally conductive casing, the second heat pipe including a closed chamber isolated from the liquid-tight chamber.
Dependencies are inferred from the claim text.