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US 12,598,724 B2Granted
Thermal transfer structures for immersion cooling
AssigneeMicrosoft Technology Licensing, LLC
InventorsSreya Sarkar, Kathryn M. Oseen-Senda, Dennis Trieu
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Abstract
A thermal management device is described. The device includes a substrate having a spreader surface and a plurality of thermal features connected to the spreader surface of the substrate. At least one thermal feature includes a body having a longitudinal axis and a hollow bore having an inner diameter perpendicular to the longitudinal axis and an opening at a distal end distal from the substrate.
Claims22
A thermal management system comprising:
- a thermal management device including:
- a substrate having a spreader surface oriented parallel to the direction of gravity, and
- a plurality of thermal features connected to the spreader surface of the substrate, wherein at least one thermal feature includes:
- a body having a longitudinal axis, and
- a hollow bore having an inner diameter perpendicular to the longitudinal axis and an opening at a distal end distal from the substrate;
- and
- a liquid working fluid, wherein the at least one thermal feature is immersed in the liquid working fluid to create a pumping effect through the hollow bore by vaporization of the liquid working fluid in the hollow bore.
4 more elements
Dependencies are inferred from the claim text.