Three-dimensional heat transfer device

A three-dimensional heat transfer device, comprising:

• a first thermally conductive casing having a bottom plate and an outer surface, wherein the outer surface is configured to be in thermal contact with a heat source;
• a second thermally conductive casing, having at least one first through hole, wherein the second thermally conductive casing is mounted on the first thermally conductive casing, and the first thermally conductive casing and the second thermally conductive casing together form a liquid-tight chamber;
• at least one first capillary structure, disposed on the first thermally conductive casing;
• at least one second capillary structure, disposed on the first thermally conductive casing, wherein a projection of the at least one first capillary structure and a projection of the at least one second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the at least one second capillary structure is located closer to the second thermally conductive casing than the at least one first capillary structure;
• at least one first heat pipe, disposed through the at least one first through hole and in contact with the at least one second capillary structure;
• at least one thermally conductive protrusion where a top surface of the thermally conductive protrusion is vertically offset from the bottom plate;
• and
• at least one second heat pipe, wherein:
• the second thermally conductive casing has at least one second through hole, the at least one second heat pipe is mounted on the at least one second through hole, the at least one second heat pipe is spaced apart from the first thermally conductive casing, the at least one first heat pipe has a first chamber that is in fluid communication with the liquid-tight chamber, the at least one second heat pipe has a second chamber that is not in fluid communication with the liquid-tight chamber, and only the at least one first heat pipe is in contact with the at least one thermally conductive protrusion.