C25F 3/30
Of semiconducting materials
Official title: of semiconducting materials
C25F3/30 (Of semiconducting materials) appears on 30 US grants and 50 published applications in this corpus.
Search patents in C25F- Granted patents
- 30
- Published applications
- 50
- Assignees
- 22
- Inventors
- 95
- Latest grant
- 17 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 3 |
| 2003 | 1 | 1 |
| 2004 | 2 | 4 |
| 2005 | 0 | 4 |
| 2006 | 2 | 1 |
| 2007 | 2 | 1 |
| 2008 | 1 | 4 |
| 2009 | 0 | 7 |
| 2010 | 2 | 6 |
| 2011 | 1 | 1 |
| 2012 | 2 | 0 |
| 2013 | 3 | 2 |
| 2014 | 0 | 1 |
| 2015 | 2 | 5 |
| 2016 | 2 | 1 |
| 2017 | 2 | 0 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 3 |
By publication year. Applications have been published since 2001.
Recent patents
- Face-up wafer electrochemical planarization apparatus17 Sep 2024US 12,090,600 B2APPLIED Materials.Inc.
- Controlled induced warping of electronic substrates via electroplating1 Feb 2022US 11,236,436 B2Rockwell Collins, Inc.
- Distribution system for chemical and/or electrolytic surface treatment31 Aug 2021US 11,105,014 B2Semsysco GmbH
- Apparatus and method for plating and/or polishing wafer12 Mar 2019US 10,227,705 B2ACM Research (Shanghai) Inc.
- Method and apparatus for pulse electrochemical polishing9 Jan 2018US 9,865,476 B2ACM Research (Shanghai) Inc.
- Polishing Pad Assembly for Electrochemical Mechanical Polishing20 Nov 2025US 2025/0353136 A1Wolfspeed, Inc.
- System and method of processing aluminum alloy16 Jan 2025US 2025/0018517 A1CompTake Technology Inc.
- Face-up wafer electrochemical planarization apparatus2 Jan 2025US 2025/0001547 A1APPLIED Materials.Inc.
- Polishing Device for Indium Phosphide Substrate, and Polishing Process1 Feb 2024US 2024/0035192 A1The 13th Research Institute of China Electronics Technology Group Corporation
- Face-up wafer electrochemical planarization apparatus7 Dec 2023US 2023/0390887 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method and apparatus for electroplating35US 8,475,644 B2Novellus Systems, Inc. · 2013
- Topography reduction and control by selective accelerator removal31US 8,158,532 B2Novellus Systems, Inc. · 2012
- Method and apparatus for electroplating28US 8,475,636 B2Novellus Systems, Inc. · 2013
- Semiconductor processing methods of removing conductive material23US 6,582,281 B2Micron Technology, Inc. · 2003
- Method for photoelectrochemical polishing of silicon wafers21US 6,074,546 ARodel Holdings, Inc. · 2000