Apparatus and method for plating and/or polishing wafer
AssigneeACM Research (Shanghai) Inc.
InventorsJian Wang, Yinuo Jin, Hongchao Yang, Hui Wang
Life of this patent
Estimating the term…
Abstract
An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.
Claims21
An apparatus for plating and/or polishing a wafer, comprising:
- a wafer chuck capable of moving horizontally and rotating and for holding and positioning the wafer, wherein the wafer chuck has an electrode, a metal ring encircling an outer edge of the wafer and an insulated ring disposed between the electrode and the metal ring;
- an auxiliary nozzle apparatus having a supplying pipe, wherein the supplying pipe has several nozzles for supplying an electrolyte solution to cover an area from the outer edge of the wafer to the electrode of the wafer chuck;
- and
- a main nozzle apparatus having a conductive body and an insulated nozzle head, wherein the conductive body has a fixing portion and a receiving portion, and the insulated nozzle head has a cover and a tube, wherein the tube is received in the receiving portion and passes through the receiving portion for supplying the electrolyte solution to a surface of the wafer, wherein a first gap is formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube, wherein the cover is disposed above the fixing portion and a second gap is formed between the cover and the fixing portion.
An apparatus for plating and/or polishing a wafer, comprising:
- a wafer chuck capable of moving horizontally and rotating and for holding and positioning the wafer;
- an auxiliary nozzle apparatus having a supplying pipe made of a conductive metal and being used as an electrode, wherein the supplying pipe has several nozzles for supplying an electrolyte solution to cover an outer edge of the wafer;
- and
- a main nozzle apparatus having a conductive body and an insulated nozzle head, wherein the conductive body has a fixing portion and a receiving portion, and the insulated nozzle head having a cover and a tube, wherein the tube is received in the receiving portion and passes through the receiving portion for supplying the electrolyte solution to a surface of the wafer, wherein a first gap is formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube, wherein the cover is disposed above the fixing portion and a second gap is formed between the cover and the fixing portion.
An apparatus for plating and/or polishing a wafer, comprising:
- a wafer chuck capable of moving horizontally and rotating and for holding and positioning the wafer;
- a main chamber;
- an auxiliary chamber separated from the main chamber;
- an auxiliary nozzle apparatus located in the auxiliary chamber and having a supplying pipe, the supplying pipe has several nozzles;
- a main nozzle apparatus located in the main chamber and having a conductive body and an insulated nozzle head, wherein the conductive body has a fixing portion and a receiving portion, and the insulated nozzle head has a cover and a tube, wherein the tube is received in the receiving portion and passes through the receiving portion for supplying an electrolyte solution to a surface of the wafer, wherein a first gap is formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube, wherein the cover is disposed above the fixing portion and a second gap is formed between the cover and the fixing portion;
- and
- a shroud including a circle portion and a rectangle portion, wherein the circle portion is disposed in the main chamber and encircling the main nozzle apparatus, and the rectangle portion is disposed in the auxiliary chamber and shielding the auxiliary nozzle apparatus, wherein the rectangle portion defining an eject window from where the electrolyte solution is ejected to cover the outer edge of the wafer, wherein a conductive metal wraps around the eject window, wherein the conductive metal is used as an electrode for charging the electrolyte solution when the electrolyte solution is ejected from the eject window.
Dependencies are inferred from the claim text.